Computer Architecture

ABSTRACT

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority under 35 U.S.C §119(e)to:

(i) U.S. Provisional Application No. 61/832,698 filed on Jun. 7, 2013and entitled “COMPUTER ARCHITECTURE RESULTING IN IMPROVED COMPONENTDENSITY AND THERMAL CHARACTERISTICS”;

(ii) U.S. Provisional Application No. 61/832,709 filed on Jun. 7, 2013and entitled “INTERNAL COMPONENT AND EXTERNAL INTERFACE ARRANGEMENT FORA COMPACT COMPUTING DEVICE”;

(iii) U.S. Provisional Application No. 61/832,695 filed Jun. 7, 2013 andentitled “ENCLOSURE/HOUSING FEATURES OF A COMPUTER FOR IMPROVED THERMALPERFORMANCE AND USER EXPERIENCE”; and

(iv) U.S. Provisional Application No. 61/832,633 filed Jun. 7, 2013,entitled “THERMAL PERFORMANCE OF A COMPACT COMPUTING DEVICE”,

each of which is incorporated herein by reference in its entirety forall purposes.

This application is related to:

(i) International Patent Application No. PCT/US2014/041165 filed Jun. 5,2014 and entitled “COMPUTER SYSTEM”;

(ii) International Patent Application No. PCT/US2014/041160 filed Jun.5, 2014 and entitled “COMPUTER THERMAL SYSTEM”; and

(iii) PCT International Patent Application No. PCT/US2014/041153, filedJun. 5, 2014, entitled “COMPUTER INTERNAL ARCHITECTURE”,

each of which is incorporated herein by reference in its entirety forall purposes.

TECHNICAL FIELD

The embodiments described herein relate generally to compact computingsystems. More particularly, the present embodiments relate to thestructure and organization of internal components and externalinterfaces for a compact computing system.

BACKGROUND

The form factor of a compact computing system, including its externalshape and arrangement of internal components, can determine a density ofcomputing power achievable. A densely packed arrangement of high-speedcomputational elements can provide significant challenges to maintainingthermal stability under varying environmental conditions. In addition, auser of the compact computing system can expect moderate to lowoperational sound levels and ready access to replaceable components.With continuous improvements in storage density and other computationalsupport elements, the user can also require expansion capability toprovide for customization and upgrades.

One design challenge associated with the manufacture of compactcomputing systems is the arrangement of structural components andfunctional components with adequate thermal heat transfer and acceptablesound levels when used in a fully functional operating state. Anadditional design challenge is to provide for user servicing of selectcomponents and ready expansion capabilities to supplement processingand/or storage capabilities of the compact computing system. Commonlyavailable expandable designs, e.g., based around a rectangular boxshaped computing tower, can be limited in adequate airflow and/orrequire complex heat transfer mechanisms for multiple computationalunits inside. “Tower” based computers can include room for expansion atthe expense of an enlarged outer enclosure, with substantial “deadspace” throughout. Alternatively, current portable computing systemsprovide highly compact designs with limited expansion capabilities,complex part replacement, and minimal user customization.

SUMMARY

The present application describes various embodiments regarding systemsand methods for providing a lightweight, durable and compact computingsystem having a cylindrical cross section. This can be accomplished atleast in part through a general computing system arrangement of internalcomponents that cooperates with a monolithic housing to provide acompact computing system having a high computing power density in acompact and durable enclosure

A desktop computing system includes a housing having a longitudinal axisand that defines an internal volume that is symmetric about thelongitudinal axis, a computing engine comprising a computationalcomponent, and a structural core positioned within the internal volumethat provides structural support for the computing engine.

A desktop computing system includes a cylindrical housing having alongitudinal axis and that encloses and defines an internal volumehaving a circular cross section centered at the longitudinal axis anddefined by a radius centered at the longitudinal axis and that isperpendicular to the longitudinal axis and a printed circuit board (PCB)disposed within the internal volume comprising a shape defined in partby a major centerline that is parallel to the longitudinal axis and isperpendicular to the radius and is located a distance from thelongitudinal axis along the radius.

A desktop computing system includes a housing having a shape that issymmetric about a longitudinal axis, an air passage spanning an entirelength of the housing, and a computational component disposed within theair passage.

Other apparatuses, methods, features and advantages of the inventionwill be or will become apparent to one with skill in the art uponexamination of the following figures and detailed description. It isintended that all such additional systems, methods, features andadvantages be included within this description, be within the scope ofthe invention, and be protected by the accompanying claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The included drawings are for illustrative purposes and serve only toprovide examples of possible structures and arrangements for thedisclosed inventive apparatuses and methods for providing compactcomputing systems. These drawings in no way limit any changes in formand detail that may be made to the invention by one skilled in the artwithout departing from the spirit and scope of the invention. Theembodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements.

FIG. 1 illustrates a perspective external view of a compact computingsystem in accordance with some embodiments.

FIG. 2 illustrates a central core of internal components of the compactcomputing system in accordance with some embodiments.

FIG. 3 illustrates an exploded view of the central core of internalcomponents of the compact computing system in accordance with someembodiments.

FIG. 4 illustrates a view of a first side of a central processing unit(CPU) board in accordance with some embodiments.

FIG. 5 illustrates a view of a second side of the CPU board attached toa structural core/heat sink in accordance with some embodiments.

FIG. 6 illustrates a top view of the CPU board mounted to a structuralcore/heat sink of the compact computing system in accordance with someembodiments.

FIG. 7 illustrates a cross sectional view of the CPU board mounted tothe structural core/heat sink of the compact computing system inaccordance with some embodiments.

FIG. 8 illustrates a view of a first side of a graphics processing unit(GPU) board in accordance with some embodiments.

FIG. 9 illustrates a view of a second side of the GPU board inaccordance with some embodiments.

FIG. 10 illustrates a cross sectional view of the GPU board mounted tothe structural core/heat sink of the compact computing system inaccordance with some embodiments.

FIG. 11 illustrates a perspective view of the CPU board that includesDIMM mechanisms attached thereto in accordance with some embodiments.

FIG. 12 illustrates another perspective view of the CPU board thatincludes DIMM mechanisms attached thereto in accordance with someembodiments.

FIGS. 13A-13C illustrates perspective views of various embodiments of aDIMM mechanism.

FIG. 14 illustrates a front perspective view and a back perspective viewof an end of the DIMM mechanism in accordance with some embodiments.

FIGS. 15A-15D illustrates a view of embodiments of a DIMM mechanism inan unlocked position and in a locked position.

FIG. 16 illustrates a top view of a wireless subsystem of the compactcomputing system in accordance with some embodiments.

FIG. 17 illustrates another top view of the wireless subsystem of thecompact computing system in accordance with some embodiments.

FIG. 18 illustrates a top perspective view of the components of thewireless subsystem of the compact computing system in accordance withsome embodiments.

FIG. 19 illustrates a bottom perspective view of the wireless subsystemof the compact computing system in accordance with some embodiments.

FIG. 20 illustrates a perspective view of an input/output assemblycoupled to a top mounted air mover assembly in accordance with someembodiments.

FIG. 21 illustrates another perspective view of the input/outputassembly coupled to the top mounted air mover assembly in accordancewith some embodiments.

FIG. 22 illustrates a front view of the interface panel of the compactcomputing system in accordance with some embodiments.

FIG. 23 illustrates a front view of an input/output flexible wallassembly for the interface panel of the compact computing system inaccordance with some embodiments.

FIG. 24 illustrates a back view of the input/output flexible wallassembly attached to the back of the interface panel of the compactcomputing system in accordance with some embodiments.

FIG. 25 illustrates a back view and a cross sectional view of a portionof the interface panel of the compact computing system in accordancewith some embodiments.

FIG. 26 illustrates a method for illuminating an illumination pattern inresponse to detecting movement of the compact computing system inaccordance with some embodiments.

FIG. 27 shows a perspective view of an embodiment of a compact computingsystem in a stand alone and upright configuration.

DETAILED DESCRIPTION

Representative applications of apparatuses and methods according to thepresently described embodiments are provided in this section. Theseexamples are being provided solely to add context and aid in theunderstanding of the described embodiments. It will thus be apparent toone skilled in the art that the presently described embodiments can bepracticed without some or all of these specific details. In otherinstances, well known process steps have not been described in detail inorder to avoid unnecessarily obscuring the presently describedembodiments. Other applications are possible, such that the followingexamples should not be taken as limiting.

The following relates to a compact computing system that can beconfigured as a stand-alone device for placement upon, underneath, oradjacent to a work surface, e.g., a table or a desk. The compactcomputing system can be referred to as a desktop computer. The compactcomputing system can include multiple internal electronic componentsincluding at least a central processing unit (CPU) board, one or moregraphics processing unit (GPU) boards, and other primary and secondaryinternal components. Although internal electronic components aregenerally rectangular in shape, the compact computing system can take ona non-rectangular form. One or more internal electronic component boardscan be shaped to match a surface of the outer enclosure of the compactcomputing system, including for example, a circular shape to match a topor bottom of a cylinder, or a curved shape to match a segment of an arcconforming to a curved exterior surface of the outer enclosure. Inrepresentative embodiments as described herein, the compact computingsystem can be cylindrical in shape and can be configured to arrange anumber of rectangular electronic components as a central core providinga form factor characterized as having a high component packing density(a number of components per available volume). The resulting compactcomputing system can provide a high computing power density in a small,lightweight, transportable form factor. In some embodiments, the compactcomputing system can also be coupled to other compact computing systemsto form a multi-computer system that can be used as a server computersystem (such as in a data farm) or as a network computing system havingeach compact computing system as a node (or nodes).

In a particular embodiment, the compact computing system can include amonolithic housing that can surround and protect the central core. Themonolithic housing can be easily removed for user servicing. Themonolithic housing can be formed of aluminum having an anodized aluminumoxide layer that both protects the housing and promotes heat transferfor cooling the central core. Aluminum has a number of properties thatmake it a good choice for the monolithic housing. For example, aluminumis a good electrical conductor that can provide good electrical ground;it can be easily machined and has well known metallurgical properties.The superior electrical conductivity of aluminum provides a chassisground for internal electrical components arranged to fit and operatewithin the housing. The aluminum housing also provides a goodelectromagnetic interference (EMI) shield protecting sensitiveelectronic components from external electromagnetic energy as well asreducing an amount of electromagnetic energy, emanating from internalcomponents within the compact computing system, from penetrating thehousing, thereby contributing to assisting to achieve goodelectromagnetic compatibility (EMC).

A layer of aluminum oxide can be formed on the surface of aluminum in aprocess referred to as anodizing. In some cases, the layer of aluminumoxide can be dyed or otherwise imbued with one or more colors to take ona specific color or colors. It should be noted that since aluminum oxideis a good electrical insulator, either the interior surface of thehousing is masked during the anodizing process, to preserve the baremetal state of the bulk material in the masked region, or selectedportions of the aluminum oxide layer are removed to provide a surfacesuitable for electrical contacts. As a solid metal structure, thealuminum monolithic housing can provide in part for thermal coolingwhile the compact computing system is operational. The anodizing processapplied to the surface of the housing can improve heat dissipationcaused by thermal radiation from external surfaces of the compactcomputing system by increasing the anodized surface's infraredemissivity.

As noted above, the housing can take on many forms, however, for theremainder of this discussion, without loss of generality, the externalhousing takes on a cylindrical shape that is separate from an internalcylindrical central core of structural components, internal processingcomponents, internal storage components, internal power regulationcomponents, and interconnect components. To maximize thermal cooling ofthe central core, the external housing can be conductively coupled toselected portions of an internal structural component that can act as arigid structural element and as a heat sink. The external housing canhave a thickness tuned to promote circumferential and axial thermalconduction that aids in mitigating hot spots on the external surface ofthe compact computing system.

A thermal management system can utilize an air mover that can be movecopious amounts of air axially through an interior volume defined by thehousing that can be used to cool a central core of the compact computingsystem in a manner that is both efficient and quiet. Generally speaking,the air mover can provide a volume of air per unit time in the form ofan airflow of about 15-20 cubic feet per minute (CFM) when majorcomponents such as a central processing unit (CPU) and/or a graphicsprocessing unit (GPU) are not being heavily utilized. However, whenprocessing demand increases, the air mover can compensate for anyincrease in heat generated by ramping up the airflow. For example, inresponse to an increase in demand for processing resources from eitheror both the CPU and/or GPU, the air mover can increase the airflow fromabout 15-20 CFM to about 25-30 CFM (at about room temperature of 25° C.)with an acoustic output of about 35 dbA (it should be noted that theseacoustic levels are only experienced when the air mover is performing ata higher end of its operating range during a period of high demand andnot during more normal operation). It should be noted that at higherambient temperature (35° C.), the air mover can ramp the airflow evenfurther to compensate for the reduced thermal transfer at the higherambient temperature. In this situation, the air mover can ramp theairflow to about 35 to 40 CFM or more having a higher acoustic output of40 dbA or more.

A separation between the central core and the housing can permit aninternal, bypass, peripheral airflow to cool a portion of the externalhousing helping to minimize a touch temperature of the housing. In oneembodiment, the external housing can mate to a base unit that provides,in part, a pedestal to support the compact computing system includingthe internal cylindrical central core when placed upright on a worksurface. The external housing can include a first opening having a sizeand shape in accordance with the base unit. The first opening canprovide for a full perimeter air inlet, e.g. through circumferentialopenings in the base unit, and the circular design can allow for fullfunctionality and adequate air intake even in those situations where thecompact computing system is located in a corner or against a wall. In anassembled configuration, the base unit corresponds to a base of acylinder. The first opening can be used to accept a flow of air from anexternal environment passing through vents in the base unit. The amountof air that flows into the housing can be related to a pressuredifferential between the external environment and an interior of thecompact computing system created by an air mover assembly. The air moverassembly can be placed next to a second opening axially disposed at anopposite end from the first opening.

In one embodiment, the air mover assembly can take the form of a fanassembly. The fan assembly can be an axial fan assembly configured toaxially move air through the housing by creating the abovementionedpressure differential. The fan assembly can also be configured as acombination of an axial and a centrifugal fan assembly. In anembodiment, air can enter the interior of the compact computing systemthrough vents in the base unit. In one embodiment, a baffle arrangementcan bifurcate the airflow in such a way that some of the airflow remainswithin a central column separate from a bypass, peripheral airflowradially disposed outward from the central column. The central column ofair (central airflow) can thermally engage a heat sink structure towhich one or more internal component boards can be mounted. The internalcomponent boards can include processing units and/or memory, at leastsome of which can be thermally coupled to the heat sink structure. Thebypass, peripheral airflow can pass over portions of one side or bothsides of the internal component boards on which high performanceprocessing units, memory, solid state drives, and/or power regulationcomponents can be mounted. In order to optimize thermal transfer, atleast some of the components can be configured and mounted axially (inthe direction of airflow) and spaced appropriately to maximize an amountof air engaging the components distributed across the internal componentboards.

In one embodiment, a vapor chamber in thermal contact with the heat sinkstructure, being placed adjacent to and/or attached to the heat sinkstructure, can be used to further increase an amount of heat transferredto the central airflow from the internal component boards. The highperformance processing units and/or portions of memory can be thermallycoupled through direct contact to the heat sink structure and/or thevapor chamber connected thereto. Both the central airflow through theheat sink structure and the bypass airflow across the internal componentboards and other internal components can be used to cool the centralcore of the compact computing system and maintain the external housingat an acceptable touch temperature.

A good electrical ground (also referred to as a chassis ground) can beused to isolate internal components that can emit significantelectromagnetic energy, e.g., a main logic board (MLB), an internalboard with higher performance computational units, high throughputinterconnects and boards, and/or other internal components with highbandwidth interfaces, from those circuits, such as wireless circuits,that are sensitive to electromagnetic energy. This electromagneticisolation can be particularly important in the compact computing systemdue to the close proximity of internal components that emitelectromagnetic energy and those nearby components that are sensitive toelectromagnetic energy. Moreover, the external housing can includeconductive material (such as a gasket infused with conductive particles)or other electrically conductive regions that can be mated to acorresponding attachment feature on the base unit or the top mounted airmover assembly completing the formation of a Faraday cage. The Faradaycage can block electromagnetic energy (both internal and external)effectively shielding the external environment from EMI generated by thecompact computing system. In order to complete the Faraday cage, airvents in the base unit can be sized to effectively block and/orattenuate electromagnetic energy having a range of selected wavelengths.More specifically, the wavelength of electromagnetic energy blockedand/or attenuated by the vents can be consistent with that emitted byactive internal components operating in the compact computing system.

In one embodiment, the compact computing system can include a sensorconfigured to detect whether or not the housing is properly in place andaligned with respect to the internal components. Proper placement of themonolithic housing is important due to the key role that both the shapeand configuration of the monolithic housing has with respect to thermalmanagement of the compact computing system as well as completing theFaraday cage discussed above. The compact computing system can includean interlock system that detects the presence and proper alignment ofthe monolithic housing with respect to the internal components. Onlywhen the proper alignment is detected, the interlock system will allowthe internal components to power up and operate in a manner consistentwith system specification. In one embodiment, the interlock system caninclude a magnetic element detectable by a Hall effect sensor only whenthe housing is in a proper position and alignment with respect to theinternal components.

Due at least to the strong and resilient nature of the material used toform the housing; the housing can include a large opening having a widespan that do not require additional support structures. Such an openingcan be used to provide access to an input/output panel and power supplyport. The input/output panel can include, for example, data portssuitable for accommodating data cables configured for connectingexternal systems that can provide expansion capabilities as input/outputdata transfer. The opening can also provide access to an audio circuit,video display circuit, power input, etc. In an embodiment, one or moredata ports (and/or icons representing the data ports and/or groupings ofdata ports) can be illuminated to provide easier access to locating andconnecting to the one or more data ports in reduced lighting.

FIG. 1 illustrates a perspective external view of a compact computingsystem 100 in accordance with some embodiments. The compact computingsystem 100 can be arranged in a shape defined by an external housing102. An arrangement of internal components of the compact computingsystem 100 and a thermal management strategy can be selected to providea computationally dense computing system having sufficient airflow tosupport high performance computing with the compact computing system 100placed in a variety of physical positions. In the described embodiments,the external housing 102 can comprise a cylindrical shape having a firstcircular opening at the base of the external housing 102, which mates toan air intake inlet/base unit 104 that can provide support forconstituent components of the compact computing system 100. The externalhousing 102 can also include a second opening located opposite the firstcircular opening, and the second opening can function as a combinationof an air exhaust outlet and a carrying handle 106.

When operational, an air mover assembly in the compact computing system100 can cause air to enter through a plurality of circumferentialopenings located in the inlet/base unit 104, to pass through an internalstructural core/heat sink and across a plurality of component boards,and to exit through the outlet/handle 106. The size of the internalstructural core/heat sink, the arrangement of multiple internalcomponent boards, the arrangement of computational and memory units onthe multiple internal component boards, the design of attached powersupplies, and the arrangement of high speed interconnects betweenvarious internal component boards can function in concert with the airmover assembly to provide a thermal management system that enables ahigh performance computing system in a compact, dense geometricarrangement, encased in the external housing 102 with an acceptabletouch temperature.

The inlet/base unit 104 of the compact computing system 100 can providesupport for the compact computing system 100. Accordingly, theinlet/base unit 104 can be formed of a strong and resilient material,e.g., a metal that can also prevent leakage of electromagnetic (EM)energy from internal components within the compact computing system 100that can radiate EM energy during operation. Thus, the inlet/base unit104 can contribute to shielding internal components from electromagneticinterference (EMI) and to blocking and/or attenuating radiant EM energyto support electromagnetic compatibility (EMC) compliance. Theinlet/base unit 104 can be formed of non-metallic compounds that can berendered conductive using, for example, conductive particles embeddedtherein. In order to assure that minimal electromagnetic energy emittedby internal components within the compact computing system 100 escapes,a conductive seal can be used to complete a Faraday cage formed at leastin part by the inlet/base unit 104 and the external housing 102.

The inlet/base unit 104 can also include a series of circumferentialvents extending around the entire inlet/base unit 104. The vents canprovide a suitable amount of air flowing from an external environment tothe internal volume of the compact computing system 100. In anembodiment, the amount of air flowing through the vents can be relatedto a pressure differential across the vents created by an air moverassembly disposed within the compact computing system 100. In oneembodiment, the air mover assembly can be disposed near the secondopening of the external housing 102, which forms an outlet/handle 106for the compact computing system 100, creating a suction effect thatreduces an ambient pressure within the external housing 102 of thecompact computing system 100. In addition to facilitating airflow, ventsin the inlet/base 104 can be sized to prevent transmission ofelectromagnetic energy into or out of the assembled compact computingsystem 100. The size of the vents in the inlet/base 104, in someembodiments, can be related to one or more wavelengths ofelectromagnetic energy emitted by internal components contained withinthe compact computing system 100.

The compact computing system 100 can further include an opening in theexternal housing 102 that can have a size and shape in accordance withan interface panel 110. The interface panel 110 can include variousports that can be used to communicate data between the compact computingsystem 100 and various external systems. For example, the interfacepanel 110 can include a set of audio ports 116 that can be used toprovide an audio stream to an external audio system, such as headphones,speakers, or an audio processor. The set of audio ports 116 can also beused to receive an audio stream from an external audio system, e.g., amicrophone or audio recording device. The interface panel 110 can alsoinclude a set of data ports, including a set of bus ports 118, a set ofhigh-speed expansion ports 120, a set of networking ports 122, and a setof video ports 114. The set of data ports can be used to transfer dataand/or power between one or more external circuits and the compactcomputing system 100. The set of data ports can be used to accommodate abroad range of data connections according to different wired datacommunication protocols, e.g., one or more Universal Serial Bus (USB)ports 118, one or more Thunderbolt high speed expansion ports 120, oneor more Ethernet networking ports 122, and one or more high definitionmedia interface (HDMI) ports 114.

The compact computing system 100 can be interconnected to othercomputing systems through one or more of the data ports provided throughthe interface panel 110, e.g., to data storage devices, portable mediaplayers, and/or video equipment, to form a network of computing systems.Accordingly, the interface panel 110 and associated data ports of thecompact computing system 100 can be used to form connections from thecompact computing system 100 to a large number and variety of externalcomputing systems and circuits, which can prove particularly useful whena large amount of computing resources is required. Moreover, the compactsize and shape of the compact computing system 100 can lend itself tospace efficient computing networks or data farms, in some representativeembodiments and uses.

The interface panel 110 can include a video port 114 that can be used tocommunicate high-speed video between the compact computing system 100and an external video monitor or other external video processingcircuitry. The interface panel 110 can include a power switch 124 thatcan be readily available to accept a user touch for initiating a poweron sequence (including, for example, a boot up process) as well as apower down sequence. In some embodiments, the power switch 124 can beilluminated and provide an activity indication to a user, e.g., undersoftware control of a processing unit in the compact computing system100. The interface panel 110 can include an alternating current (AC)power input port 112, which can be sized and shaped to accept a powerplug suitable for transferring external power to operational electroniccomponents within the external housing 102. In some embodiments, thecompact computing system 100 can include internal power resources (suchas a battery) that can be charged and re-charged in accordance withpower delivered by way of power input port 112.

The external housing 102 can include a mechanical latch 108 that can beused to couple the external housing 102 of the compact computing system100 securely to internal structures of the compact computing system 100.The mechanical latch 108 can take the form of a sliding latch or othersuch operable mechanism that can be manually engaged and disengaged. Inthis way, the external housing 102 can be easily removed in order toexpose internal components and structures of the compact computingsystem 100 for user maintenance, upgrade, or servicing by a servicecenter. A detection circuit (not shown) of the compact computing system100 can be used to detect whether the external housing 102 is properlysituated in place with respect to internal components and structures.The detection circuit can serve a useful function as the thermalmanagement strategy of compact computing system 100 can rely on theproper placement and use of the external housing 102 in combination withthe arrangement of internal components and an air mover assembly insidethe compact computing system 100.

In some embodiments, the detection circuit can determine that theexternal housing 102 is not in proper placement or alignment withrespect to internal structures or components of the compact computingsystem 100, and the detection circuit can prevent the compact computingsystem 100 from operating, or at least from operating at full capacity.In one embodiment, the detection circuit can include a magnetic sensor(such as a Hall Effect device) located to detect one or more magnetsdisposed on the external housing 102 when the external housing 102 isproperly placed and aligned on the compact computing system 100.

FIG. 2 illustrates a central core 200 of internal components assembledtogether and positioned on the inlet/base 104 of the compact computingsystem 100 with the external housing 102 removed. The cylindrical shapeof compact computing system 100 can dictate the arrangement of variousinternal components as well as set requirements for thermal management.For example, internal components of the compact computing system 100 canbe arranged in an axial manner that optimizes both a component packingdensity (the number of operational components per available volume) anda computing power density (computing power per available volume).Moreover, the axial arrangement of internal components can optimize anamount of heat that can be transferred from the internal components to acentral structural heat sink and then to a central airflow (not shown)that passes through the central structural heat sink as well as frominternal components to a peripheral airflow 214 that passes across theinternal components. For example, one or more memory modules 216, e.g.,dual inline memory modules (DIMMs), can be constructed from a substrateon which are mounted multiple memory chips. The memory modules 216 canbe arranged along a major axis 210 of the compact computing system 100parallel to the peripheral airflow 214, which can pass across themultiple memory chips contained thereon. In order to optimize heattransfer from the memory chips to the peripheral airflow 214, the memorychips, in some embodiments, can be mounted onto an underlying substratein a manner that aligns with the peripheral airflow 214. In this way, anefficient thermal transfer interface can be formed between theperipheral airflow 214, which flows inside the external housing 102, andthe memory modules 216.

In an embodiment, the central core 200 of internal components caninclude an exhaust assembly 218, which can include an air mover assembly(not shown), disposed in close proximity to the outlet/handle 106 of theexternal housing 102, and which can provide an exit path for an exhaustairflow 204. The air mover assembly of the exhaust assembly 218 cancombine a central airflow (not shown), which passes through a centralstructural heat sink of the central core 200 of internal components, andthe peripheral airflow 214, which passes over internal component boardsand other internal components, to form the exhaust airflow 204. Theexhaust assembly 218 can direct the exhaust airflow 204 toward theoutlet/handle 106, and at least part of the outlet/handle 106 canintercept a portion of the exhaust airflow 204 in a manner thatfacilitates the transfer of thermal energy generated by internalcomponents of the compact computing system 100 to the external housing102. A cosmetic shield 202 can be used to cover operational componentscontained in the exhaust assembly 218, such as radio frequency (RF)processing circuitry and one or more antennas located on top of theexhaust assembly 218. The cosmetic shield 202 can be formed of an RFtransparent material such as plastic, ceramic, or glass.

Due to the electrically conductive nature of the external housing 102,it can be preferred to use the external housing 102 as a chassis groundto provide a good electrical ground for internal components of thecompact computing system 100. Accordingly, a set of vertical touchpoints 212 on an input/output subassembly cover adjacent to theinterface panel 110 can be formed of a conductive material and can beused to form a conductive path between internal components of thecompact computing system 100 and a matching set of vertical conductivepatches on the interior surface of the external housing 102. To form agood electrical connection, portions of the external housing 102 thatcontact the vertical touch points 212 can be masked and/or laser etchedduring a manufacturing process to ensure the portions that contact thevertical touch points 212 are devoid of any non-conductive or insulatingmaterial (such as aluminum oxide). When the external housing 102includes an aluminum oxide layer formed thereon, selected portions ofthe aluminum oxide can be removed to expose the underlying electricallyconductive bulk material in locations that come into contact with thevertical touch points 212.

In addition to providing a chassis ground, the external housing 102 canbe used in conjunction with the inlet/base 104 and the exhaust assembly218 to prevent leakage of electromagnetic energy to and from theinternal components of the compact computing system 100 by forming aFaraday cage. A contact surface 206 of the exhaust assembly 218 can bemasked or laser etched during a manufacturing process to form anelectrically conductive contact surface 206 that can contact anelectrically conductive gasket positioned inside of the external housing102. The electrically conductive gasket of the external housing 102 cancontact the electrically conductive contact surface 206 of the exhaustassembly 218 when the external housing 102 is properly placed over theinternal components of the compact computing system 100 and positionedto enclose the internal components in a securely latched position. Theexternal housing 102 can also include an electrically conductive regionon the bottom surface of the external housing 102, which can contact anelectrically conductive bottom gasket 208 mounted on (or formed as anintegral part of) the inlet/base 104. In addition, portions of aninput/output (I/O) subassembly cover, which can include, embeddedwithin, the interface panel 110, can include bare metal regions that canalso contact directly to corresponding bare metal regions of theinlet/base 104 and/or the exhaust assembly 218. Select portions of theinternal structural core/heat sink, in some embodiments, can alsocontact the inlet/base 104 and the exhaust assembly 218 when theinternal components of the compact computing system 100 are properlyassembled.

An effective Faraday cage for the compact computing system can be formedusing a combination of the following: (1) an electrically conductivering formed between the contact surface 206 of the exhaust assembly 218and a gasket (not shown) mounted in the interior of the external housing102, (2) an electrically conductive ring formed between the bottomgasket 208 of the inlet/base 104 and the bottom of the external housing102, (3) one or more arc shaped electrically conductive regions alongthe bottom interior surface of an input/output (I/O) subassembly coverin contact with matching electrically conductive arc shaped regionsalong a surface of the inlet/base 104, (4) one or more electricallyconductive arc shaped regions along a surface of the exhaust assembly218 in contact with matching electrically conductive arc shaped regionsalong the interior surface of the top of the I/O subassembly cover, and(5) vertical touch points 212 in contact with matching vertical regionsalong the interior surface of the external housing 102. In addition,mounting points on the central structural core/heat sink can beelectrically in contact with the inlet/base 104 and with the exhaustassembly 218.

FIG. 3 illustrates an exploded view 300 of the central core 200 ofinternal components of the compact computing system 100 in accordancewith some embodiments. The central core 200 of internal components canbe formed around a structural core/heat sink 310, which can serve as astructural core to which internal component boards can be mounted. In anembodiment, the structural core/heat sink 310 can be shaped as atriangle, e.g., an isosceles triangle having two equal length sides anda third longer side, extended in some embodiments at each corner to formstructural standoff elements. Cooling fins 311 can fan out from aninside surface of the longer side to inside surfaces of the two equalsides. In one embodiment, a central cooling fin can bisect thetriangular central volume defined by sides of the structural core/heatsink 310 forming two similar triangular regions. In one embodiment,other cooling fins can extend from the longer side to the other sides atan angle related to a distance from the center cooling fin. In this way,the cooling fins can form a symmetric cooling assembly within thetriangular central volume. The structural core/heat sink 310 can includethree vertical stanchions 314 that vertically span a portion of theinterior of the external housing 102 of the compact computing system100. Between each pair of vertical stanchions 314 a face of thestructural core/heat sink 310 can span a portion of a chord thatstretches horizontally across the interior of the external housing 102of the compact computing system 100. On each of the three faces of thetriangular structural core/heat sink 310, a vapor chamber assembly 312can be positioned to contact the surface of the face of the structuralcore/heat sink 310. In a representative embodiment, a portion of eachface of the structural core/heat sink 310 can be removed to form acavity in which can be inlaid with the vapor chamber assembly 312. Insome embodiments, the structural core/heat sink 310 and/or the vaporchamber assembly 312 can include mount points by which to attachinternal component boards. The internal component boards can include oneor more computational processing units, graphical processing units,and/or memory units which can transfer heat generated therein to thestructural core/heat sink 310 through the vapor chamber assembly 312.

In a representative embodiment, two faces of the structural core/heatsink 310 can be sized in accordance with a form factor used for graphicsprocessing unit (GPU) boards 306 that can be mounted thereto. In arepresentative embodiment, a third face of the structural core/heat sink310 can be sized in accordance with a form factor used for a centralprocessing unit (CPU) board 318 that can be mounted thereto. In anembodiment, the structural core/heat sink 310 can be formedapproximately in the shape of an isosceles triangle having two faces ofan equal width on which to mount two GPU boards 306 and a third facehaving a longer width on which to mount the one CPU board 318. In someembodiments, the longer width of the face of the structural core/heatsink 310 on which mounts the CPU board 318 can determine a diameter ofthe cylindrical central core 300 of internal components, and therebysubstantially determine a diameter for the external housing 102 as wellas for the assembled compact computing system 100.

In an embodiment, each GPU board 306 can be mounted to the structuralcore/heat sink 310 with the GPU and surrounding video memory facing (andin thermal contact with) the structural core/heat sink 310, e.g.,through a corresponding vapor chamber assembly 312 mounted on and/orembedded in the structural core/heat sink 310. In an embodiment, a solidstate drive 308 can be mounted on an outward facing side of one or bothGPU board(s) 306, in a space between the external housing 102 and theGPU board 306. In an embodiment, the solid state drive 308 can bearranged as a vertical set of components along the vertical major axis210 of the compact computing system and can be positioned centrallyalong the width of the GPU board 306 in a region having the widest spacebetween the outer housing 102 and the GPU board 306. The arrangement andplacement of the solid state drive 308 can be determined to maximize anamount of airflow passing across the solid state drive 306. In anembodiment, a CPU board 318 can be mounted to the structural core/heatsink 310 with the CPU facing (and in thermal contact with) thestructural core/heat sink 310, e.g., through direct contact with a vaporchamber assembly 312 mounted on and/or embedded in the face of thestructural core/heat sink 310.

In an embodiment, full size dual inline memory modules (DIMMs) thatsupport the CPU can be positioned in DIMM mechanisms 320 mounted on anoutward facing side of the CPU board 318 (on the opposite side of theCPU board 318 on which the CPU and CPU socket is placed). The DIMMmechanisms 320 can be tilted into a locked position that angles theDIMMs toward the interior of the central core 200 of components in thedirection of the CPU, e.g., toward a vertical centerline of the CPUboard 318. The DIMM mechanisms 320 can also be tilted into an unlockedposition that angles the DIMMs away from the interior of the centralcore 200 of internal components, e.g., away from the CPU and in thedirection of the external housing 102. In an embodiment, the DIMMmechanisms 320 can restrict a user from inserting and/or removing theDIMMs when in the locked position and permit the user to insert and/orremove the DIMMs when in the unlocked position. The DIMM mechanism 320can angle the DIMMs within a circle bounded by the exterior housing 102when in the locked position and position the DIMMs at least partiallyoutside the circle when in the unlocked position to provide access forDIMM insertion and removal by the user of the compact computing system100.

The CPU board 318 and the GPU boards 306 can be connected to each otherand/or to an I/O board 324 through an interconnect board 316, which canalso be referred to as a main logic board (MLB) in some embodiments. Inan embodiment, the CPU board 318 can be connected to the interconnectboard 316 through a double row edge connector to a matching socketmounted centrally on the interconnect board 316. The connection of theCPU board 318 through the double edge row connector can provide acompact arrangement within the central core 200 of components of thecompact computing system 100. In an embodiment, the GPU board(s) 306 canbe connected to the interconnect board 316 through wide bandwidth flexconnectors (e.g., flex cables).

In some embodiments, the wide bandwidth flex connectors can alsofunction as baffles to direct at least a portion of airflow incomingfrom the inlet/base 104 to bifurcate and spread across the surface ofthe GPU board(s) 306. Adjacent to the CPU board 306, a power supply unit(PSU) 322 can be positioned between the DIMM mechanisms 320. In andembodiment, a cross section of the PSU is shaped as a trapezoid to fitcompactly between the DIMM mechanisms 320, the CPU board 318, and an I/Oboard 324. In an embodiment, an external AC power source can beconnected through the interface panel 110 and through the I/O board 324to the PSU 322, which can convert the AC power to one or more DCvoltages. The DC power from the PSU 322 can be connected to the GPUboard(s) 306 and/or the CPU board 318 through thin, flexible, flat,copper bus bars. The I/O board 324 can be mechanically connected to thePSU 322 and/or to the I/O subassembly cover 326 through which theinterface panel 110 can connect the internal core 300 of the compactcomputing system 100 to the external world. The I/O board 326 canprovide numerous high-speed interfaces for the compact computing system100 through a common high bandwidth flex connector connected to theinterconnect board 316, which in turn can connect by additional highbandwidth connectors to the CPU board 318 and GPU board(s) 306. Thearrangement of component boards and other units illustrated in FIG. 3provides for a maximally dense computational core of componentsthermally coupled to a large structural core/heat sink 310 for thecompact computing system 100.

In some embodiments, the structural core/heat sink 310 can be connectedmechanically to a top mounted exhaust assembly 218, which can include animpeller 304 and a plenum plate 328 connected to exhaust assembly 218through which the exhaust airflow 204 can be drawn. In an embodiment,the exhaust assembly 218 can include a wireless subsystem 302 mountedwithin a cavity embedded in a top surface of the exhaust assembly 218and capped by the cosmetic shield 202. In some embodiments, mount pointson the vertical stanchions 314 of the structural core/heat sink 310 canelectrically couple the top mounted exhaust assembly 218 to thestructural core/heat sink 310. The structural core/heat sink 310 canalso be connected mechanically to a bottom-mounted inlet/base 104. Insome embodiments, mount points on the vertical stanchions 314 of thestructural core/heat sink 310 can electrically couple the inlet/base 104to the central core/heat sink 310.

FIG. 4 illustrates a front view of a first side 400 of the CPU board 318including a centrally mounted CPU 402 flanked on either side by verticalDIMM mechanisms 320 mounted on the opposite side of the CPU board 318.In some embodiments, the CPU 402 is mechanically and electricallycoupled to the CPU board 318 by low profile thermal module 404 thatcooperates with a flexible high strength spring mechanism (illustratedas spring 502 in FIGS. 5-7) to compress CPU 402 into a socket disposedbeneath CPU 402. Fasteners disposed through openings 406 in CPU board318 and engaged within threaded apertures of low profile thermal module404 allow the compression of the CPU 402 into the socket. The lowprofile thermal module 404 is described in more detail in FIG. 7. Thespring mechanism can be disposed on the other side of the CPU board 318opposite of the CPU 402. The CPU board 318 can have one or more openings408 through which fasteners (illustrated as fasteners 504 in FIG. 5) canengage attachment points disposed on the structural core/heat sink 310thereby coupling CPU board 318 to the structural core/heat sink 310. Asdescribed in more detail in FIG. 5, the spring mechanism can haveopenings corresponding to openings 408 that allow fasteners to be driventhrough both the spring mechanism and CPU board 318.

In some embodiments, a layout of the CPU board 318 provides a highbandwidth data path through a double row edge connector at the base ofthe CPU board 318, e.g., illustrated as CPU board edge connector 410 inFIG. 4. As illustrated in FIG. 4, DC power for the CPU board 318 can beprovided through one or more DC inputs 412 arranged on a top edge of theCPU board 318. In an embodiment, one or more flat copper interconnectingbus bars connect the DC inputs 412 of the CPU board 318 to the PSU 322.In an embodiment, a DC/DC regulation section 414 on the CPU board 318can regulate and/or convert the DC power provided through the DC inputs412 to provide a set of stable DC voltages as required for thecomputational components mounted on the CPU board 318, including atleast memories mounted in the DIMM mechanisms 320 and the CPU 402. Byarranging the layout of the CPU board 318 with the DC power flowing fromthe top edge and the high-speed digital data input/output from thebottom edge, a compact efficient CPU board 318 can be achieved. In anembodiment, the bottom edge of the CPU board 318 includes a double rowCPU board edge connector 410 through which the high-speed digital datainput/output flows to a mating socket mounted on the interconnect board316.

In some embodiments, the DIMM mechanisms 320 include memory modulesockets that are press fit connected to the CPU board 318, e.g., inorder to not require the use of surface mount technology (SMT) on bothsides of the CPU board 318 simultaneously. In an embodiment, some or allof the components of the CPU board 318, e.g., the DC/DC regulationsection 414, are arranged to promote airflow in a vertical directionfrom the CPU board edge connector 410 on the bottom across the CPU 402and memories in the DIMM mechanisms 320 through the DC/DC regulationsection 414 to a top mounted air mover assembly (not shown). Asillustrated, the CPU 402 can be mounted on one side of the CPU board 318oriented to contact the vapor chamber assembly 312 attached to thestructural core/heat sink 310. In order for the memory modules to beserviceable without removal of the CPU board 318 from being attached tothe structural core/heat sink 310, the DIMM mechanisms 320 can bemounted on the side of the CPU board 318 opposite the CPU 402. Asdescribed above, in some embodiments, the DIMM mechanisms 320 caninclude a tilt and lock feature that angles the memory modules containedtherein toward the interior of the compact computing system 100 when inthe locked position and angles the memory modules outward to permit useraccessibility when in the unlocked position.

FIG. 5 illustrates a front view of a second side 500 of the CPU board318 including a portion of a CPU spring 502 flanked by DIMM mechanisms320 on a left side and a right side of the CPU board 318. The CPU spring502, in some embodiments, can provide for attaching the CPU 402 to thesocket and/or to the structural core/heat sink 310 through one or moreattachment points, e.g. mounted on and/or integral with the structuralcore/heat sink 310 and/or the vapor chamber assembly 312 attachedthereto. Force can be applied by fasteners 504 and 506 along CPU spring502 to flatten it against the second side of CPU board 318 as depicted.

In some embodiments, the CPU spring 502 can include flexible metal bands508 that provide the force for seating the CPU 402 into the socket. TheCPU spring 502 can also include flexible metal bands 510 that allow theCPU board 318 to be coupled to the vapor chamber assembly 312, therebyregulating an amount of force that is exerted when mounting the CPUboard 318 to the structural core/heat sink 310. In some embodiment,flexible metal bands 510 can cause about 30 pounds of force to beexerted when mounting CPU board 318 to vapor chamber assembly 312.Flexible metal bands 510 can also be used to help keep CPU 402 seated inthe socket. When the CPU board 318 is fastened to the vapor chamberassembly 312, a raised portion of the CPU 402 can also be compressedwhen flexible metal bands exert the force upon the CPU board 318 throughbacker plate 509, thereby causing the CPU 402 to be pressed directlyagainst a surface of the vapor chamber assembly 312. It should be notedthat fasteners 506 can extend only into low profile thermal module 404,allowing the CPU spring 502 to securely seat CPU 402 in the socket priorto installing CPU board 318 to the structural core/heat sink 310 withfasteners 504.

In some embodiments, the CPU spring 502 can be formed as two separatestructural units (1) to press the CPU 402 into the socket 604 and (2) tocompress the CPU 402 against the vapor chamber assembly 312. In someembodiments, the CPU spring 502 can be formed as a single structureperforming both functions, e.g., as illustrated in FIG. 5.

In an embodiment, the CPU board 318 includes one or more DIMM connectorsockets mounted on the second side 500 of the CPU board 318 opposite tothe first side 400 on which the CPU 402 can be mounted. In anembodiment, the DIMM connector sockets are mounted using press fitconnectors (instead of connectors that require surface mounttechnology). In an embodiment, the DIMM connector sockets accept fullsize DIMMs. As illustrated in FIG. 5, the DIMMs connector sockets can bemounted along the major axis 210 of the central core 200 of internalcomponents of the compact computing system 100, which can provide fororienting the DIMMs to align with the peripheral airflow 214substantially along their entire length. In an embodiment, the DIMMmechanisms 320 provide for tilting toward the center of the CPU board318 into a locked position for use when the compact computing system 100is operational and for tilting away from the center of the CPU board 318into an unlocked position for use when a user of the compact computingsystem (or a service technician) inserts, replaces, and/or removes theDIMMs from the DIMM connector sockets.

FIG. 6 illustrates a top view of the CPU board 318 mounted to thestructural core/heat sink 310 of the central core 200 of internalcomponents of the compact computing system 100. Between each pair ofvertical stanchions 314 of the structural core/heat sink 310, a vaporchamber assembly 312 can be mounted to a face of the structuralcore/heat sink 310. In a representative embodiment, the CPU board 318can be attached to the structural core/heat sink 310 through a set ofattachment points 602 that project through (and/or are integral with)the vapor chamber assembly 312 along the face of the structuralcore/heat sink 310. Fasteners 504 can be driven through the CPU spring502 and openings 408 of CPU board 318 to engage attachment points 602.In conjunction with CPU spring 502, fasteners 504 can apply a force thatboth establishes a robust thermal contact between a raised portion ofthe CPU 402 and vapor chamber assembly 312 and securely attaches the CPUboard 318 to the structural core/heat sink 310.

As described above, DC power can be supplied to the CPU board 318through one or more connectors (DC inputs 412) located at the top edgeof the CPU board 318. In an embodiment, the DC inputs 412 can be locatedon the top edge of the CPU board 318 opposite to the bottom edge of theCPU board 318 that can include a high-speed edge connector through whichhigh-speed data can be communicated to the interconnect board 316. Onthe left and right edges of the CPU board 318, two DIMM mechanisms 320can be mounted on the side of the CPU board 318 facing away from thestructural core/heat sink 310 (and therefore on the opposite side of theboard from the CPU 402.) The DIMM mechanisms 320 can provide for guidingand holding in place one or more memory modules 216, e.g., full sizeDIMMs. In an embodiment, the DIMM mechanisms 320 can be tilted inwardtoward the center of the CPU board 318 when in a locked position (e.g.,when the compact computing system 100 is assembled and operational) andcan be tilted outward away from the center of the CPU board 318 in anunlocked position (e.g., when providing for insertion and/or removal ofthe memory modules 216 from the DIMM sockets and DIMM mechanisms 320).

In one embodiment, a cooling fin (referred to as center cooling fin311-1) can extend from first planar face 610 to a junction of secondplanar face 612 and third planar face 614. In this way, the triangularcentral volume defined by heat sink 310 is bisected into first region Iand second region II each having similar right triangular crosssections. In one embodiment, first cooling fin 311-2 spanning region Ican be at first angle Ø1 with respect to first planar face 610. Firstangle Ø1 can have an angular value that varies in accordance with adistance X₁ between first cooling fin 311-2 and central cooling fin311-1. Similarly, second cooling fin 311-3 spanning region II can be atfirst angle Ø2 with respect to first planar face 610. Second angle Ø2can have an angular value that also varies in accordance with a distanceX₂ between second cooling fin 311-3 and central cooling fin 311-1.Generally speaking, distance X₁ and distance X₂ are about equal,however, the number of cooling fins actually implemented in eitherregions I or II can vary as required for a particular design as can thevarious geometric relationships. In one embodiment, a summation of firstangle Ø1 and second angle Ø2 can be about 180°.

FIG. 7 illustrates a cross sectional view 700 of the CPU board 318mounted to the structural core/heat sink 310 of the compact computingsystem 100 in accordance with some embodiments. The cross-sectional view700 of the CPU board 318 can correspond to a section line A-A depictedin FIG. 5 through at least a portion of the central core 200 ofcomponents of the compact computing system 100. FIG. 7 depicts how theCPU 402 can be secured to socket 604 using low profile thermal module404. In some embodiments, low profile thermal module 404 can have anopening having a size in accordance with a raised portion of the CPU402. In this regard, the raised portion can pass through the opening oflow profile thermal module 404 so that it can be in direct thermalcontact with the vapor chamber assembly 312.

In this regard, in addition to seating CPU 402, low profile thermalmodule 404 can have threaded apertures into which fasteners 506 can beengaged. Fasteners 506 can pass through openings 406 of CPU board 318,openings in spring 502 to engage the threaded apertures in low profilethermal module 404.

FIG. 8 illustrates a view of a first side 800 of a graphics processingunit (GPU) board in accordance with some embodiments. A GPU 802 can becentrally mounted on the GPU board 306, and one or more video randomaccess memory (VRAM) 804 units can be positioned symmetrically about theGPU 802. In a representative embodiment, the GPU 802 and the VRAM 804can be mounted on the same side of the GPU board 306, which can beplaced in contact with the vapor chamber assembly 312 embedded within aface of the structural core/heat sink 310. In an embodiment, a GPUthermal module spring can compress the GPU 802 against the vapor chamberassembly 312, providing thermal coupling of the GPU 802 to thestructural core/heat sink 310, when the GPU board 306 is mounted to thestructural core/heat sink 310 through a set of attachment points 602. Insome embodiments, the VRAM 804 can also contact the vapor chamberassembly 312 to provide a thermal conduction path to the structuralcore/heat sink 310 when the GPU board 306 is attached thereto. In anembodiment, the layout of VRAM 804 around the GPU 802 can arrange theVRAM 804 to permit approximately equal airflow across and/or adjacent tothe VRAM 804 when the GPU board 306 is attached to the structuralcore/heat sink 310.

In an embodiment, the GPU board 306 can include one or more powerconnection points (indicated in FIG. 8 as GPU DC inputs 806) at the topedge of the GPU board 306 through which DC power can be supplied fromthe PSU 322. As described above for the CPU board 318, the GPU board 306can include DC/DC power regulation at a top edge of the GPU board 306and a high-speed digital data connection from the bottom edge of the GPUboard 306. In an embodiment, the GPU board 306 can connect to theinterconnect board 316 through a high-speed flex connector. In someembodiments, the high-speed flex connector also provides an air baffleto bifurcate airflow from the inlet/base 104 into a central airflowthrough the structural core/heat sink 310 and the peripheral airflow 214across the surface of the internal component boards. In an embodiment,the high-speed flex connector also spreads the peripheral airflow 214 toprovide airflow along the outer sections of the GPU board 306, e.g.,across and/or adjacent to the VRAM 804.

FIG. 9 illustrates a second side 900 of the GPU board 306 in accordancewith some embodiments. As described above, the GPU board 306 can bemounted with the GPU 802 and VRAM 804 facing toward and in thermalcontact with the structural core/heat sink 310, e.g., using attachmentpoints 602 that are connected to and/or an integral part of thestructural core/heat sink 310 and/or the vapor chamber assembly 312. Inan embodiment, a GPU thermal module spring 902 can be used at least inpart to attach the GPU board 306 to the structural core/heat sink 310 bythe attachment points 602. In an embodiment, the GPU thermal modulespring 902 can compress the GPU 802 against the vapor chamber assembly312 to provide positive thermal contact between the GPU 802 and thestructural core/heat sink 310, e.g., through the vapor chamber assembly312 mounted on and/or embedded in the face of the structural core/heatsink 310.

In some embodiments, the GPU thermal module spring 902 can also causeall or a portion of the VRAM 804 adjacent to the GPU 802 to contact thevapor chamber assembly 312, thereby providing thermal contact forcooling of the VRAM 804. In some embodiments, the GPU board 306 can beprovided one or more DC voltages through one or more GPU DC inputs 806located at a top edge of the GPU board 306. In some embodiments, a DC/DCregulation section 414 can regulate and convert the one or more DCvoltages to provide DC power to the components of the GPU board 306. Inan embodiment, the GPU board 306 can include a GPU rigid flex connectorsocket 904 located along a bottom edge, (opposite of the top edge towhich the DC power can be supplied), through which a high-speed flexconnector can communicate data to the interconnect board 316. In someembodiments, a solid state drive (SSD) 308 can be mounted along themajor axis 210 of the GPU board 306 in the center (side to side) of theGPU board 306 across the back side of the GPU 802 and spanning the GPUthermal module spring 902, as illustrated in FIG. 9. In an embodiment, alayout of components on the GPU board 306 can place taller componentstoward a central middle line (top to bottom) of the GPU board 306 andshorter components toward the outer sides of the GPU board 306.

In some embodiments, multiple components of the GPU board 306 can bestacked along a central major axis 210 of the GPU board 306 (e.g., GPU802, GPU thermal module spring 902, and SSD 308) in a region of theinterior of the compact computing system that can accommodate a greaterheight of components than adjacent regions. In some embodiments, the GPUboard 306, when mounted to the structural core/heat sink 310 and placedon the inlet/base 104 within the external housing 102, can form asegment of a chord across the interior of the external housing 102, witha larger volume available for component placement along the middle ofthe segment of the chord and a smaller volume available for componentplacement along the outer portions of the segment of the chord. In someembodiments, component placement on the GPU board 306 can be arranged toaccommodate the volume constraints imposed by the position of the GPUboard 306 relative to the external housing 102.

FIG. 10 illustrates a cross sectional view 1000 of the GPU board 306mounted to the structural core/heat sink 310 of the compact computingsystem 100 in accordance with some embodiments. The cross sectional view1000 can correspond in some embodiments, to a view that cuts along lineB indicated in FIG. 9 through at least a portion of the central core 200of components of the compact computing system 100. The GPU board 306 canbe mounted to a face of the structural core/heat sink 310 with the GPU802 contacting a surface of the vapor chamber assembly 312, which can beattached to and/or embedded in the face of the structural core/heat sink310. The GPU thermal module spring 902, in an embodiment, can compressthe GPU 802 against the vapor chamber assembly 312. In an embodiment,the GPU board 306 can attach to the structural core/heat sink 310through a set of attachment points 602 that protrude from the structuralcore/heat sink. In an embodiment, separate GPU boards 306 can be mountedto each of two faces of the structural core/heat sink 310, and the CPUboard 318 can mount to a third face of the structural core/heat sink310. In an embodiment, the solid state drive 308 can mount across theGPU thermal module spring 902 on side of the GPU board 306 opposite tothe side on which the GPU 802 can be mounted.

FIG. 11 illustrates a perspective view 1100 of the CPU board 318 thatincludes DIMM mechanisms 320 attached thereto in accordance with someembodiments. In an embodiment, the CPU board 318 includes a CPU 402mounted on a side opposite the CPU spring 502 illustrated in FIG. 11. Inan embodiment, the DIMM mechanisms 320 and the CPU 402 are mounted onopposite sides of the CPU board 318. In an embodiment, DC power issupplied through one or more DC inputs 412 at a top edge of the boardabove the CPU 402, and high-speed digital signals are communicatedthrough a bottom edge of the board below the CPU 402, e.g., through theCPU board edge connector 410. In an embodiment, the DIMM mechanism 320provides a guide, torsional support, a tilting function, and alock/unlock function for memory modules 216 installed therein. In anembodiment, the DIMM mechanism 320 includes a DIMM mechanism actuator1104, which the user can engage to tilt, to lock, and to unlock the DIMMmechanism 320. It should be noted that although actuator 1104 ishereinafter referred to as button 1104, it is contemplated that any typeof mechanism suitable for actuating DIMM mechanism 320 is possible.

In an embodiment, the DIMM mechanism 320 includes guides to seat thememory modules 216 into a DIMM connector base 1102 mounted to the CPUboard 318. In an embodiment, the DIMM connector base 1102 is mounted tothe CPU board 318 as a press fit connector. In an embodiment, the usercan engage the DIMM mechanism 320 by pushing on the DIMM mechanismbutton 1104 to switch the DIMM mechanism 320 from an unlocked (tiltedoutward) position to a locked (tilted inward) position, e.g., to lockthe memory securely in sockets in the DIMM connector base 1102. The usercan also engage the DIMM mechanism 320 by pushing on the DIMM mechanismbutton 1104 to switch the DIMM mechanism 320 from the locked position toan unlocked position, e.g., in order to remove, replace, or installmemory modules 216 in the DIMM mechanism 320. In an embodiment, the DIMMmechanism 320 provides for a short over-travel distance when a userpresses the DIMM mechanism button 1104 and the DIMM mechanism 320 is inthe locked position. In an embodiment, the DIMM mechanism 320 providesfor a spring-loaded action to tilt the DIMM mechanism 320 from theinward locked position to an outward unlocked position after the userpresses the DIMM mechanism button 1104.

FIG. 12 illustrates another perspective view 1200 of the CPU board 318that includes DIMM mechanisms 320 attached thereto in accordance withsome embodiments. The DIMM mechanisms 320 illustrated in FIG. 11 arepopulated with memory modules 216 installed, while the DIMM mechanisms320 illustrated in FIG. 12 are empty, with no memory modules 216installed. The DIMM mechanism 320 can include a torsion bar 1202 thatlinks the two ends of the DIMM mechanism 320 together and provides forforce applied to one end of the DIMM mechanism 320, e.g., to the DIMMmechanism button 1104, to transfer and apply to the other end of theDIMM mechanism 320. The DIMM mechanism 320 can also include DIMM guides1204 that assist the user to properly align and seat the memory modules216 when inserting into the DIMM mechanism 320 to connect with the DIMMconnector base 1102. In some embodiments, the DIMM mechanism 320 canaccommodate memory modules 216 that are “full size” DIMMs having alength of approximately 133 mm, (e.g., as used in desktop personalcomputers).

In an embodiment, the DIMM mechanism 320 can accept insertion of thememory modules 216 at an acute angle (not perpendicular) to the DIMMconnector base 1102. In some embodiments, a user can insert a memorymodule 216 into the DIMM mechanism 320 at an acute angle in an unlockedposition and rotate the DIMM mechanism 320 into a locked position bypressing at one side of the DIMM mechanism 320, e.g., on the DIMMmechanism button 1104. In some embodiments, the torsion bar 1202 of theDIMM mechanism 320 transfers at least a portion of a force exerted bythe user on one end of the DIMM mechanism 320, e.g., by pressing theDIMM mechanism button 1104, to an opposite end of the DIMM mechanism320, e.g., to assist in rotating, locking, positioning, and/or actuatingthe full length DIMM in a socket of the DIMM connector base 1102.

FIG. 13A illustrates a front perspective view 1300 and a backperspective view 1310 of the DIMM mechanism 320 in accordance with someembodiments. Each end of the DIMM mechanism 320 can include a push/pushDIMM lock mechanism 1302 that provides for angling the DIMM mechanism320 (including the memory modules 216 installed therein) into aninterior of the compact computing system 100 when in a locked,operational position and angling at least a portion of the DIMMmechanism 320 outside a circular region bounded by the external housing102 when in an unlocked position for installation and removal of thememory modules 216. Each end of the DIMM mechanism 320 connects to anopposing end of the DIMM mechanism 320 by the torsion bar 1202.

One end of the DIMM mechanism 320 can include the DIMM mechanism button1104, through which the user can press to tilt the DIMM mechanism 320into a locked position or to release the DIMM mechanism 320 from alocked position into an unlocked position. In an embodiment, as the DIMMmechanism 320 tilts, the memory modules 216 contained therein also tilt.In some embodiments, a user can press on one or multiple surfaces of theDIMM mechanism 320 to tilt the memory modules 216 into a locked positionor into an unlocked position. In some embodiments, a user can press on asurface of the memory module 216 to tilt the DIMM mechanism 326 (and thememory modules 216 contained therein) into a locked position or torelease a latch and tilt the DIMM mechanism 326 (and the memory modules216 contained therein) into an unlocked position. In some embodiments,“lock” and “unlock” (and other forms of these words) can also bereferred to as “latch” and “unlatch” (as well as other synonymouswords).

FIGS. 13B and 13C illustrates another embodiment of a dual inline memorymodule (DIMM) mechanism. More specifically, FIG. 13B shows frontperspective view of DIMM mechanism 1320 in a closed, or latched,configuration whereas FIG. 13C shows DIMM mechanism 1320 in an open, orunlatched, configuration. In an embodiment, in the unlocked position,the memory modules 216 positioned within the DIMM mechanism 1320 aresubstantially perpendicular to the printed circuit board to which theDIMM mechanism 1320 can be attached through the DIMM connector base1102. In this embodiment, DIMM mechanism 1320 can include first actuator1322 and second actuator 1324. In an embodiment, first actuator 1322 andsecond actuator 1324 are configured to present an appearance of a singlepiece in keeping with presenting a clean and aesthetically pleasingappearance. In any case, first actuator 1322 and second actuator 1324are designed in such a way as to resist opening (unlatching) of DIMMmechanism 1320 in spite of a high shock load applied to housing 102.More specifically, unless acted upon in a specific manner, DIMMmechanism 1320 remains in the latched configuration thereby securingDIMM 310 within. Accordingly, DIMM mechanism 1320 can secure DIMM 310 inthe latched configuration whereas DIMM mechanism 1320 can render DIMM310 accessible and available for removal (or replacement) in theunlatched configuration.

As shown in FIG. 13B, first actuator 1322 and second actuator 1324 areco-planar with respect to each other presenting a compact, well defined,and aesthetically pleasing structure. In order to access and releaseDIMM 310 secured by DIMM mechanism 1320 (or make DIMM mechanism 1320available to receive a new or replacement DIMM), first force F1 can beapplied directly to actuator 1322. In an embodiment, first force F1 mustovercome a biasing force applied by a biasing member (shown in moredetail in FIG. 15B) that causes first actuator 1322 to move about pivot1326 causing DIMM locking mechanism 1328 to tilt from a locked positionas shown in FIG. 13B to an unlocked position shown in FIG. 13C. In anembodiment, as DIMM mechanism 1320 tilts, the memory modules 216contained therein also tilt providing easy user access that facilitatesremoval or insertion of memory modules 216. It should also be noted,that as locking mechanism 1328 tilts from the latched to the unlatchedposition (and vice versa), second actuator 1324 moves in such a way thatan orientation of second actuator 1324 in the latched and unlatchedconfiguration remain essentially unchanged with respect to DIMM base1102. In this way, second actuator 1324 is well position for the user toapply latching force F2 to second actuator 1326 causing lockingmechanism 1328 to tilt back to the latched position and first actuator1322 to undergo a second movement around pivot 1326.

FIG. 14 illustrates a front perspective view 1400 and a back perspectiveview 1410 of an end of the DIMM mechanism 320 that includes the DIMMmechanism button 1104 in accordance with some embodiments. The DIMMmechanism 320 at each end can include a push/push DIMM lock mechanism1302 that includes multiple interconnected bars that form a movablelinkage assembly. One end of the DIMM mechanism 320 can include the DIMMmechanism button 1104, and each end of the DIMM mechanism 320 caninclude DIMM guides 1204 to align the memory modules 326 upon insertion.In some embodiments, the DIMM mechanism 320 can block an improperlyinserted memory module 216 from engaging with a socket in the DIMMconnector base 1102.

In some embodiments, the DIMM mechanism 320 can reject an improperlyinserted memory module 216. In some embodiments, the DIMM mechanism 320can prevent a user from latching an improperly inserted memory module216 into a locked position. In some embodiments, the DIMM mechanism 320can be not capable of latching into a locked position when a memorymodule 216 is improperly inserted therein. In some embodiments, the DIMMguides 1204 can assist, at least in part, a user to insert a memorymodule 216 in a correct orientation for properly engaging the DIMMmechanism 320. In some embodiments, the DIMM mechanism 320 includesretention features that hold the memory module 216 in a correct positionwhen in the locked position. In some embodiments, one or more “holddown” features can translate into a position that retains the memorymodule 216 in a proper position in the DIMM mechanism 320 when in alocked position.

FIG. 15A illustrates a first end view 1500 of the DIMM mechanism 320 inwhich the push/push DIMM lock mechanism 1302 is oriented in an unlockedposition and a second end view 1510 of the DIMM mechanism 320 in whichthe push/push DIMM lock mechanism 1302 is oriented in a locked position.In an embodiment, in the unlocked position, the memory modules 216positioned within the DIMM mechanism 320 are substantially perpendicularto the printed circuit board to which the DIMM mechanism 320 can beattached through the DIMM connector base 1102. In an embodiment, in thelocked position, the memory modules 216 positioned within the DIMMmechanism 320 are tilted away from perpendicular and angled toward acentral area of the printed circuit board to which the DIMM mechanism320 can be attached. In an embodiment, a user can push the DIMMmechanism button 1104 to tilt the DIMM mechanism 320 from the unlockedposition 1500 into the locked position 1510.

In an embodiment, the push/push DIMM lock mechanism 1302 includes threeparallel bars, each parallel bar connected to a fourth bar that crossesthe three parallel bars. In an embodiment, the fourth crossing bar canbe connected to one end of a first outside parallel bar and to anopposite end of a second outside parallel bar of the push/push DIMM lockmechanism 1302. In an embodiment, the fourth crossing bar also connectsto an inside parallel bar, which is positioned between the two outsideparallel bars. In an embodiment, the fourth crossing bar includes anopen region that allows the fourth crossing bar to travel with respectto the underlying three parallel bars as the push/push DIMM lockmechanism 1302 is engaged and disengaged, e.g., when changing from alocked position to an unlocked position. In an embodiment, the size ofthe open region of the fourth crossing bar can determine at least inpart an amount of movement between the unlocked position and the lockedposition of the DIMM mechanism 320. In an embodiment, a spring latch(not indicated) can engage the push/push DIMM lock mechanism 1302 whenin the locked position, and a user can push the DIMM mechanism button1104 to unlock the push/push DIMM lock mechanism, which can “overtravel” a short distance further inward, thereby disengaging the springlatch and forcing the push/push DIMM lock mechanism 1302 to rotateoutward as the fourth crossing bar rotates and slides until reaching anend of the open region. In an embodiment, an amount of “over travel”inward and an amount of travel outward by the push/push DIMM lockmechanism 1302 can be determined at least in part by the length of theopen region of the fourth crossing bar.

FIGS. 15B-15D are views of DIMM mechanism 1320 illustrating a manner inwhich (push/push) DIMM lock mechanism 1328 transitions from the latched(locked) orientation to the unlatched (unlocked) orientation. Morespecifically, FIG. 15B shows DIMM mechanism 1320 in latched orientation1502, whereas FIG. 15C shows DIMM mechanism 1320 in a transitionalorientation 1504 to better illustrate the kinematics of DIMM mechanism1320 and finally FIG. 15D illustrating DIMM mechanism 1320 in anunlatched (or unlocked) orientation 1506. In an embodiment shown in FIG.15B, DIMM locking mechanism 1328 is oriented in the latched position1502 whereby surface 1508 of arm 1510 integrally formed with firstactuator 1322 is held in place against biasing force F_(bias) providedby biasing mechanism 1512. In an embodiment, biasing mechanism 1512 cantake the form of a spring. More specifically, biasing mechanism 1512 cantake the form of a torsional spring configured to provide a torsionalbiasing force to DIMM locking mechanism 1328. More specifically, biasingforce F_(bias) can be create a frictional coupling between surface 1508of arm 1510 and surface 1514 of locking feature 1516 that is part ofDIMM latching mechanism 1328. It should be noted that the spatialrelationship between surface 1508 and surface 1514 could be adjusted tocustomize a “feel” of DIMM mechanism 1320. It should be noted that foot1516 could limit the pivoting movement of first actuator about pivot1326. In this way, first actuator 1322 can be aligned with secondactuator 1324 in such a way as to provide the appearance of a singlepart effected by first actuator 1322 and second actuator 1324 in thelatched orientation.

As shown in FIG. 15C, as force F1 is applied to first actuator 1322,both first actuator 1322 and first member 1518 move about pivot 1326.The movement of first member 1518 about pivot 1326 causes second member1520 to translate both horizontally and vertically (by way of pin 1522moving through slot 1524) resulting in second actuator 1324 translatinghorizontally and maintaining essentially an original orientationthroughout the unlatching process. In other words, as shown in FIG. 15D,a final position of second actuator 1324 is parallel to an initialposition of second actuator 1324 with respect to DIMM base 1102. In thisway, a user interaction with second actuator 1326 also remainsessentially unchanged regardless of a current orientation (latched orunlatched) of DIMM mechanism 1320. It should also be noted that aspatial relationship between edges of surface 1508 and surface 1514 canbe adjusted in manner to customize a “snap” feeling when DIMM mechanism1320 moves from transitional orientation 1506 to unlatched orientation1508 shown in FIG. 15D.

It should be noted that the relative contours or surface 1504 and 1510can be used to adjust a “feel” of DIMM mechanism 1302 during theunlatching process. In the unlatched orientation, the memory modules 216positioned within the DIMM mechanism 1320 are substantiallyperpendicular to the printed circuit board to which the DIMM mechanism1320 can be attached through the DIMM connector base 1102. In anembodiment, in the locked position, the memory modules 216 positionedwithin the DIMM mechanism 1320 are tilted away from perpendicular andangled toward a central area of the printed circuit board to which theDIMM mechanism 1320 can be attached.

FIG. 16 illustrates a top view 1600 of the wireless subsystem 302 of thecompact computing system 100 in accordance with some embodiments. In anembodiment one or more antennas 1604 are mounted inside air exhaustvents of the exhaust assembly housing 1602. In an embodiment, the one ormore antennas 1604 are arranged symmetrically about a center point ofthe exhaust assembly housing 1602. Each antenna 1604 can be connected acorresponding antenna cable 1608 to wireless processing circuitry (notshown) mounted beneath a wireless processing circuitry top cover 1606.In some embodiments, the wireless processing circuitry top cover 1606 isformed of an electrically conductive metal and can form in part aFaraday cage to shield the wireless processing circuitry from extraneousradio frequency interference or noise.

In some embodiments, a radio frequency transparent cosmetic shield 202can cover the antenna assembly and wireless processing circuitry. In anembodiment, a ring of magnets embedded in the exhaust assembly housing1602 can surround the antenna assembly and provide a magnetic attractionfor a metallic ring mounted inside the radio frequency transparentcosmetic shield 202. In an embodiment, a number of conductive gaskets1612 can be placed between the magnets 1610 to provide a conductive pathfor radio frequency interference signals. The magnets 1610 andconductive gaskets 1612 can be omitted in some embodiments, and theradio frequency transparent cosmetic shield 202 can be mechanicallyattached to the exhaust assembly housing 1602, e.g., formed of a pliablematerial that can be shaped to grip a portion of the exhaust assemblyhousing 1602 when assembled on the compact computing system 100. In anembodiment, the antennas 1604 can be positioned outside a set ofimpeller mount points 1614 to which the impeller 304 attaches to theexhaust assembly housing 1602. In an embodiment, at least a portion ofthe impeller mount points and/or attachment mechanisms can beelectrically conductive to ensure the impeller mount points 1614 are notfreely floating metal pieces in proximity to the radio frequencyantennas 1604 of the wireless subsystem 302.

FIG. 17 illustrates another top view 1700 of the wireless subsystem 302of the compact computing system 100 in accordance with some embodiments.The top view 1700 in FIG. 17 illustrates wireless processing circuitrysituated between the impeller mount points 1614, which attach theimpeller 304 within the exhaust assembly housing 1602. The top view 1700in FIG. 17 resembles the top view 1600 of FIG. 16 with the wirelessprocessing circuitry top cover 1606 removed. In an embodiment, one ormore antennas 1604 can connect through associated antenna cables 1608 toindividual wireless antenna connection points 1708 on a wirelessprocessing circuitry board 1702, which can be sandwiched to a wirelessinterposer board 1704 between the impeller mount points 1614.

A wireless processing circuitry interconnect 1706 can include a flat,flexible cable that can communicate digital (and/or analog) signals fromthe wireless processing circuitry board 1702 to another circuit board(not shown) of the compact computing system 100 for further processing.The wireless processing circuitry interconnect 1706 can also communicatesignals from other processing circuitry in the compact computing system100 to the wireless processing circuitry board 1702, e.g., formodulation and transmission through one or more of the antennas 1604. Insome embodiments, analog radio frequency processing circuitry and/ordigital radio frequency processing circuitry can be mounted on thewireless processing circuitry board 1702. The analog and digital radiofrequency processing circuitry on the wireless processing circuitryboard 1702 can provide, at least in part, for transmission and receptionof protocol data units according to one or more wireless communicationprotocols. In some embodiments, multiple antennas 1604 can be used fortransmission and/or reception of radio frequency signals between thecompact computing system 100 and additional wireless communicationdevices.

FIG. 18 illustrates a top perspective view 1800 of the antenna assemblyand wireless processing circuitry for the compact computing system 100in accordance with some embodiments. In an embodiment, threesymmetrically positioned antennas 1604 each can connect through separateantenna cables 1608 to the wireless processing circuitry board 1702. Anadditional secondary antenna housing 1806 can include a fourth antennathat connects through a secondary antenna cable 1804 to the wirelessprocessing circuitry board 1702. In an embodiment, the three topantennas 1604 can be used to communicate according to a first wirelesscommunication protocol, while the fourth front mounted (secondary)antenna can be used to communicate according to a second wirelesscommunication protocol. In an embodiment, the four antennas 1604(including the front mounted secondary antenna) can be used together tocommunicate according to a wireless communication protocol, e.g., in amultiple-input multiple-output (MIMO) mode.

In an embodiment, wireless signal processing circuitry on the wirelessprocessing circuitry board 1702 can select among the different antennas1604 (including in some embodiments the front mounted secondary antenna)to transmit and/or receive radio frequency signals based on measuredradio frequency signal quality conditions, using one or more of theantennas 1604 alone or together. In an embodiment, the wirelessprocessing circuitry board 1702 includes radio frequency processingcircuitry that can communicate according to a wireless local areanetwork (WLAN) communication protocol, e.g., a Wi-Fi protocol, and/oraccording to a wireless personal area network (WPAN) communicationprotocol, e.g., a Bluetooth protocol. In an embodiment, digital signalsfrom the wireless processing circuitry board 1702 can be communicatedthrough the wireless processing circuitry interconnect 1706 cable toanother circuit board (not shown) of the compact computing system forfurther processing. In some embodiments, the digital signals of thewireless processing circuitry board 1702 can pass through the wirelessinterposer board 1704 to which the wireless processing circuitryinterconnect 1706 can be attached.

FIG. 19 illustrates a bottom perspective view 1900 of the wirelesssubsystem 302 of the compact computing system 100 in accordance withsome embodiments. In an embodiment, wireless processing circuitry 1902can be mounted on the wireless processing circuitry board 1702 and canreceive and/or transmit radio frequency signals through one or moreantennas 1604 connected by antenna cables 1608 and/or a front mountedantenna in the secondary antenna housing 1806. The wireless processingcircuitry board 1702 can communicate digital data (e.g., protocol dataunits) through the wireless processing circuitry interconnect 1706 cablewhich can mount to another circuitry board (not shown) of the compactcomputing system, e.g., to communicate with a “higher layer”applications processor, e.g., the CPU 402 or other digital chip providedfor digital communication formatting and processing. In someembodiments, the wireless processing circuitry interconnect 1706 canconnect to the wireless interposer board 1704 which then can connect tothe wireless processing circuitry board 1702.

FIG. 20 illustrates a perspective view 2000 of an input/output (I/O)assembly coupled to a top mounted air mover assembly in accordance withsome embodiments. The top mounted air mover assembly can include, insome embodiments, the impeller 304 coupled to the exhaust assembly 218and covered by the plenum plate 328 that can draw an airflow through thecentral core 200 of components of the compact computing system 100. Theexternal housing 102 of the compact computing system 100 can include anopening through which an interface panel 110 can be located, e.g., asillustrated in FIG. 1. The interface panel 110 can be attached to theI/O subassembly cover 326, which can complete at least in part a portionof a Faraday cage that blocks and/or attenuates electromagnetic energyfrom entering or exiting the external housing 102. In an embodiment, theinterface panel 110 can be formed of a radio frequency transparentmaterial, e.g., a hardened plastic, and a separate perforated wire meshpanel (not shown) can line portions of the interior of the interfacepanel 110 to limit electromagnetic energy from passing through theinterface panel 110.

As illustrated in FIG. 20, a number of openings for I/O ports can beaccommodated. In addition, in some embodiments, the secondary antennahousing 1806 can be mounted inside of the I/O subassembly cover 326containing a secondary antenna (not shown) to communicate radiofrequency signals through a radio frequency transparent window in theinterface panel 110 (and/or the I/O subassembly cover 326). In someembodiments, wireless processing circuitry 1902 (not shown) cancommunicate digital signals through the wireless processing circuitryinterconnect 1706 cable, which can attach to a circuit board (not shown)placed along the back of the I/O assembly. In an embodiment, one or moreindividual icons and/or grouping icons for the I/O ports of theinterface panel 110, e.g., can be illuminated under computer control oflight emitting diodes (LEDs) as described further herein. In someembodiments, signals to control the illumination of one or more of theindividual icons and/or grouping icons for the I/O ports can becommunicated through an LED flex cable 2002 mounted on the rear of theinterface panel 110 (and or to the I/O subassembly cover 326). In anembodiment, the interface panel 110 includes an opening for AC powerconnection 112, and AC power cable 2004 can transmit received AC powerfrom AC power connector 112 to the power supply unit 322 (not shown).

FIG. 21 illustrates another perspective view 2100 of the input/outputassembly coupled to the top mounted air mover assembly in accordancewith some embodiments. FIG. 21 illustrates an input/output (I/O) board2102 mounted on the interior face of the I/O subassembly cover. In someembodiments, the I/O board 2102 illustrated in FIG. 21 substantiallycorresponds to the I/O board 324 illustrated in FIG. 3. The I/O board2102 can include multiple I/O connectors that can project through theinterface panel 110. The I/O board can provide a high speed dataconnection through an I/O rigid flex connector 2104 for the set of I/Oports of the compact computing system 100. In an embodiment, the I/Origid flex connector 2104 can terminate a flex cable (not shown) thatconnects to the interconnect board 316, thereby providing a highbandwidth connection between the set of I/O ports on the I/O board 2102and the CPU board 318 and GPU board(s) 306, which also connect to theinterconnect board 316.

The wireless processing circuitry interconnect 1706 can also connect tothe I/O board 2102 providing at least a portion of a data path betweenthe wireless processing circuitry 1902 mounted in the top portion of theair mover assembly and one or more processing chips on the interconnectboard 316, the CPU board 318, and/or the GPU boards 306. In anembodiment, high speed connections through flex connectors to the GPUboard(s) 306 and/or through edge connectors to the CPU board 318 caninclude multiple lanes of a peripheral component interconnect express(PCIe) interface, e.g., 32 lanes of a PCIe 2.X/3.X/4.X interface. Insome embodiments, the high bandwidth connection between the I/O board2102 and the interconnect board 316 can utilize multiple lanes of one ormore peripheral component interconnect express (PCIe) interfaces, e.g.,32 lanes of a PCIe interface, 2×16 lanes of two parallel PCIeinterfaces, n×32 lanes of multiple PCIe interfaces, or othercombinations of one or more PCIe interfaces.

FIG. 22 illustrates a front view 2200 of the interface panel 110 of thecompact computing system 100 in accordance with some embodiments. In anembodiment, the interface panel 110 can be formed at least in part usinga transparent material covered with one or more layers of paint on itssurface. In an embodiment, a portion of the one or more layers of paintcan be laser etched to reveal a portion of a surface layer beneath. Inan embodiment, one or more icons and/or groupings can be formed using aprocess that includes painting and laser etching a surface of theinterface panel 110. As illustrated in FIG. 22, icons on the interfacepanel 110 can indicate individual ports and/or groups of ports. In anembodiment, an illuminable icon 2202 can be formed adjacent to anindividual port and/or centered among a group of ports on the interfacepanel 110. The illuminable icon 2202 can provide a graphical indicationof a function of the port with which the illuminable icon 2202 can berelated. In an embodiment, a set of audio ports 116 can be labeled usingone or more illuminable icons 2202, e.g., a first illuminable icon 2202to indicate a speaker (audio output) port and a second illuminable icon2202 to indicate a microphone (audio input) port. In an embodiment, aset of bus ports 118 can be labeled using an illuminable icon 2202,e.g., centrally placed among the set of bus ports 118, and also can belabeled using an illumination pattern 2204, which can circumferentiallydelineate the set of bus ports 118 from adjacent ports on the interfacepanel 110.

In an embodiment, as illustrated in FIG. 22, the illumination pattern2204 can include a rounded edge rectangle that surrounds the set of busports 118. Similarly, in an embodiment, the set of high-speed expansionports 120 can be labeled using a combination of a centrally placedilluminable icon 2202 and a perimeter bounded illumination pattern 2204.In an embodiment, a set of networking ports 122 can be labeled with anilluminable icon 2202 and by an illumination pattern 2204 surroundingthe set of networking ports 122. In an embodiment, an adjacentilluminable icon 2202 can label the video port 114. In some embodiments,the power switch 124 can be illuminated and provide one or more activityindications through flashing (or other changes) to the illumination. Theinterface panel 110 can also include an AC power inlet opening 2206through which an AC power input port 112 can be accessed.

FIG. 23 illustrates a front view 2300 of an input/output (I/O) flexiblewall assembly 2310 that can be mounted on the interior of the interfacepanel 110 for the compact computing system 100 in accordance with someembodiments. The I/O flexible wall assembly 2310 can include one or moreicon light emitting diodes (LEDs) 2304 that can be positioned adjacentto one or more icon light guides 2302. The icon LEDs 2304 can transmitlight through the icon light guides 2302 which can be placed behindcorresponding illuminable icons 2202. In an embodiment, each illuminableicon 2202 can be paired with a corresponding icon light guide 2302 andicon LED 2304, which can be controlled to illuminate the correspondingilluminable icon 2202, e.g., through control signals received over theLED flex cable 2002 from control processing circuitry in the compactcomputing system 100. In some embodiments, one or more grouping LEDs2308 can be positioned adjacent to one or more grouping light guides2306 which can be placed about a grouping of ports, e.g., behind acorresponding illumination pattern 2204. The one or more grouping LEDs2308 can transmit light through the grouping light guides 2306. In anembodiment, each illumination pattern 2204 can be paired with acorresponding grouping light guide 2306 which can transmit light arounda set of ports of the interface panel 110. In a representativeembodiment, a pair of grouping LEDs 2308 can be placed at corners ofeach grouping light guide 2306.

FIG. 24 illustrates a back view 2400 of the input/output flexible wallassembly 2310 attached to the back of the interface panel 110 of thecompact computing system 100 in accordance with some embodiments. TheI/O flexible wall assembly 2310 can be attached to position lone or moreicon light guides 2302 and/or grouping light guides 2306 to providelight from one or more LEDs 2304/2308 to a region behind illuminableicons 2202 and/or illumination pattern 2204. The illuminable icons 2202and/or the illumination pattern 2204 can be lit under control of one ormore processors in the compact computing system 100. In an embodiment,one or more sensors, e.g., accelerometers, can sense movement of thecompact computing system and illuminate one or more illuminable icons2202 and/or illumination pattern 2204 to assist a user of the compactcomputing system to locate a particular port or set of ports on theinterface panel 110.

FIG. 25 illustrates a back view 2500 and a cross sectional view 2510 ofa portion of the interface panel 110 of the compact computing system 100in accordance with some embodiments. As described above for FIGS. 22-24,one or more illuminable icons 2202 and/or illumination pattern 2204 canbe formed on (and/or through) the interface panel 110 and can beilluminated from behind using a corresponding light guide and LED. Theinterface panel 110, in some embodiments, can be formed of a translucentand/or light transparent material that can be dyed and/or painted invarious regions and/or areas. In an embodiment, a light blocking region2504 can be formed around the periphery of one or more port opening(s)2502 through which an I/O port of the interface panel 110 can project.In an embodiment, the light blocking region 2506 can be formed byinfusing a penetrating dye into regions adjacent to one or more portopenings 2502 in the interface panel 110. In an embodiment, a lighttransparent region 1504 can abut the light blocking region 2506 thatsurrounds each of the port openings 2502.

In an embodiment, the interface panel 110 can be initially formedsubstantially entirely of a light transparent material (such as plastic)and select regions surrounding each port opening 2502 in the interfacepanel 110 can be transformed to be light blocking regions 2506. In anembodiment each light transparent region 2504 adjacent to one or morelight blocking regions can encompass an area that includes at least anillumination pattern 2204 for a set of ports. The illumination patterncan be formed by laser etching away one or more layers of paint appliedto a surface of the interface panel 110. As illustrated by the crosssection view 2510, the interface panel 110 can include a port opening2502 surrounded by a light blocking region 2506, which in turn isadjacent to a light transparent region 2504. In a manufacturing process,one or more layers of paint can be applied to an outer facing surface ofthe interface panel 110. In an embodiment, a white paint layer 2508followed by a black paint layer 2512 can be applied to the outer facingsurface of the interface panel 110. Subsequently, a portion of the blackpaint layer 2512 can be laser etched to remove black paint forming alaser etched opening 2514 in the black paint layer 2512 (e.g., in theshape of an illuminable icon 2202 and/or an illumination pattern 2204)to reveal the white paint layer 2508 beneath.

In some embodiment, the white paint layer is transparent to a portion oflight provided by a grouping LED 2308 transmitted by a grouping lightguide 2306 placed adjacent to the read facing side of the interfacepanel 110. As illustrated in FIG. 25, LED light 2516 from the groupingLED 2308 can be guided by the grouping light guide 2306 through aportion of the light transparent region 2504 behind the laser etchedopening 2514, thereby providing back illumination for the illuminationpattern 2204 (or equivalently for an illuminable icon 2202). The lightblocking region 2506, situated between the light transparent region 2504through which the LED light 2516 passes and the port opening 2502, canblock the LED light 2516 from emanating from the port opening.

FIG. 26 illustrates a method 2600 for illuminating the illuminationpattern 2204 of a set of ports on the interface panel 110 in response todetecting movement of the compact computing system 100 in accordancewith some embodiments. The method includes at least the following steps.In a first step 2602, a processing element in the compact computingsystem 100 detects at least one of a rotational movement and atranslational movement of the compact computing system 100. In a secondstep 2604, the processing element communicates an illumination controlsignal to the input/output flexible wall 2310 mounted on an interiorface of the interface panel 110 of the compact computing system 100. Ina third step 2606, in response to obtaining the illumination controlsignal, one or more light emitting diodes (LEDs) associated with the setof ports, e.g., one or more grouping LEDs 2308, are activated totransmit a beam of LED light 2516, guided by a grouping light guide 2306adjacent to the set of ports, through a laser etched opening 2514 in apaint layer 2512 on an outer surface of the interface panel 110. Thelaser etched opening 2514 surrounds the set of ports, wherein a firstportion of the interface panel 110 adjacent to the grouping light guide2306 is at least partially transparent to the beam of LED light 2516(e.g., light transparent region 2504) and wherein a second portion ofthe interface panel 110, adjacent to the first portion of the interfacepanel 110 and adjacent to at least one port in the set of ports, isopaque to the beam of light, e.g., light blocking region 2506.

FIG. 27 shows a perspective view of compact computing system 2700.Compact computing system 2700 can have a shape defined by housing 2702.In the described embodiments, housing 2702 can be cylindrical in shapehaving a first opening 2704 characterized as having diameter d1. Morespecifically, housing 2702 can take the form of a circular rightcylinder having a longitudinal axis that extends long a centerline of acentral volume enclosed by housing 2702. Housing 2702 can becharacterized as having a circular cross section having a center pointcoincident with a corresponding point on the longitudinal axis. Thecircular cross section has a radius that is perpendicular to thelongitudinal axis and extends outwardly therefrom. Accordingly,thickness t of housing 2702 (more specifically a housing wall) can bedefined as a difference between an outer radius ro associated with anexterior of housing 2702 and inner radius r_(i) associated with aninterior surface of housing 2702. Moreover, housing 2702 can includesecond opening 2706 axially disposed from first opening 2704 havingdiameter d2 defined in part by exhaust lip 2708 where d1 is at leastequal to or greater than d2. Housing 2702 can be formed from a singlebillet of aluminum in the form of a disk that can be extruded in amanner forming exhaust lip 2708. Thickness t of housing 2702 can betuned to mitigate hot spots. In this regard, housing 2702 can have anon-uniform thickness t. In particular, portion 2710 near exhaust lip2708 can have a first thickness of about 4-6 mm that then changes to asecond thickness associated with portion 2712 that is reduced from thefirst thickness and located away from exhaust lip 2708. In this way,portion 2710 can act as both an integrated handle used to grasp compactcomputing system 2700 and as a feature that absorbs and conducts thermalenergy transferred from a portion of exhaust airflow 2714 that engagesexhaust lip 2708. Through radiative and conductive heat transfer and bylimiting the amount of heat transferred to portion 2712, the formationof local hot spots in housing 2702 can be mitigated. Tuning thethickness of housing 2702 can be accomplished using, for example, animpact extrusion process using a metal disk that is then machined to thedesired thickness profile. The metal disk may be made of aluminum,titanium, and any other metallic material that provides the strength,thermal conductivity, and RF-isolation desired. The extrusion processforms a cylinder that is machined in the exterior portion and in theinterior portion to acquire the desired cross sectional profile and alsothe desired visual appeal from the exterior.

Compact computing system 2700 can further include base unit 2716. Baseunit 2716 can be used to provide support for compact computing system2700. Accordingly, base unit 2716 can be formed of strong and resilientmaterial along the lines of metal that can also prevent leakage ofelectromagnetic (EM) energy from components within compact computingsystem 2700 that radiate EM energy during operation. Base unit 2716 canalso be formed of non-metallic compounds that can nonetheless berendered electrically conductive using, for example, electricallyconductive particles embedded therein. In order to assure that anyelectromagnetic energy emitted by components within compact computingsystem 2700 does not leak out, lower conductive gasket 2718 can be usedto complete a Faraday cage formed by base unit 2716 and housing 2702.Upper conductive gasket 2720 (shown in more detail in FIG. 3) can bedisposed on the interior surface of housing 2702 near a lower edge ofportion 2710. Use of conductive gaskets 2718 and 120 to complete theFaraday cage can increase EMI isolation by about 20 dB.

Base unit 2716 can also include vents 2722. Vents 2722 can be dualpurpose in that vents 2722 can be arranged in base unit 2716 in such away that a suitable amount of air from an external environment can flowthrough vents 2722 in the form of intake airflow 2724. In oneembodiment, intake airflow 2724 can be related to a pressuredifferential across vents 2722 created by an air mover disposed withcompact computing system 2700. In one embodiment, the air mover can bedisposed near second opening 2706 creating a suction effect that reducesan ambient pressure within housing 2702. In addition to facilitatingintake airflow 2724, vents 2722 can be sized to prevent leakage ofelectromagnetic energy there through. The size of vents 2722 can berelated to a wavelength corresponding to electromagnetic energy emittedby internal components.

It should be noted that although a cylindrical housing is shown, thatnonetheless any suitably shaped housing can be used. For example,housing 2702 can be have a rectangular cross section, a conical crosssection (of which the circle is only one), or the cross section can takethe form of an n-sided polygon (of which the rectangle is one in whichn=4 and a triangle where n=3) where n is an integer having a value of atleast 3.

A desktop computing system is described having a housing having aninterior surface that defines an internal volume and having alongitudinal axis, a computing engine that includes a computationalcomponent and a structural core positioned within the internal volumethat provides structural support for the computing engine such that thecomputing engine takes on a general shape of the structural core. In oneembodiment, the structural core includes a heat sink that facilitatesremoval from the desktop computing system at least some heat generatedby the computing engine.

In one embodiment, the structural core includes a heat sink thatfacilitates removal of heat from the cylindrical volume and the heatsink includes a plurality of planar faces that provides the structuralcore with a triangular shape that encloses a central thermal zone havinga triangular cross section such that the computing engine takes on thetriangular shape of the structural core. In one embodiment, the centralthermal zone is generally parallel to the longitudinal axis and anexterior surface of the plurality of planar faces and an interiorsurface of the cylindrical housing define a peripheral thermal zoneapart from the central thermal zone. In one embodiment, a thermalmanagement system and the computing engine cooperate to maintain atemperature of the computational component within a pre-determined rangeof operating temperatures such that a central airflow through thecentral thermal zone and a peripheral airflow are directed through theperipheral thermal zone. In one embodiment, the desktop computing systemis characterized as having a computing density defined as a peakoperating rate of the computing engine over an amount of time divided bythe cylindrical volume. In one embodiment, the cylindrical housing isformed of aluminum. In one embodiment, a shape of the computationalcomponent is defined by a minor centerline corresponding to a minorlength and a major centerline corresponding to a major length.

In one embodiment, the major centerline is perpendicular to the minorcenterline. In one embodiment, an internal structure of thecomputational component is organized generally parallel to the majorcenterline and in accordance with the major length. In one embodiment,the computational component includes a first node at a first end and asecond node at a second end opposite the first end. The desktopcomputing system also includes a printed circuit board (PCB) having aPCB shape defined by a PCB major centerline, and an electrical trace andthe computational component is mounted to the PCB and electricallyconnected to the electrical trace. In one embodiment, the PCB is mountedto one of the plurality of planar faces and the PCB centerline isgenerally parallel to the longitudinal axis and the PCB is one of aplurality of PCBs each having their respective major centerlines beinggenerally parallel to the longitudinal axis and at least one PCB is agraphics processing unit (GPU) board In one embodiment, the GPU boardcomprises: a graphics processing unit (GPU) and a video random accessmemory (VRAM) coupled to the GPU via a corresponding electrical trace.In one embodiment, the system includes a central processing unit (CPU)board comprising: a central processing unit (CPU) mounted to a firstside of the CPU board and a memory module mounted on a second side ofthe CPU board and electrically connected to the CPU where the first sideis opposite the second side of the CPU board.

In one embodiment, an Input/Output (I/O) board that includes aninput/output (I/O) interface board comprising a high speed data portwhere the high speed data port is accessible to an external system. Inone embodiment, the system includes an interconnect board connected to(1) the GPU board through a first wide bandwidth interconnect cable, (2)the I/O interface board through a second wide bandwidth interconnectcable, and (3) the CPU board through a wide bandwidth edge connectors onthe CPU board and a socket connector on the interconnect board. In oneembodiment, the system also includes a power supply unit arranged toprovide one or more direct current (DC) voltages to a top edge of theGPU board opposite to a bottom edge of the GPU board to which the firstwide bandwidth interconnect cable attaches, and to a top edge of the CPUboard opposite a bottom edge of the CPU board that includes the widebandwidth edge connector. In one embodiment, the first and second widebandwidth interconnects comprise flexible cables, and a third widebandwidth interconnect comprises one or more edge connectors on the CPUboard mated to one or more corresponding socket connectors on theinterconnect board.

A desktop computing system is described. The desktop computing systemincludes a housing having an interior surface that defines an internalvolume having a longitudinal axis and a computing engine located withinthe internal volume where the computing engine has a generallytriangular cross section that is perpendicular to the longitudinal axis.

In one embodiment, the desktop computing system includes a heat sink inthermal contact with at least the computational component where the heatsink includes a plurality of planar faces at least one of which isparallel to the longitudinal axis and at least one of the plurality ofplanar faces provides a structural support for the computing engine. Inone embodiment, the computational component is mounted to one of theplurality of planar faces. In one embodiment, the computationalcomponent has a shape having a major centerline corresponding to a majordimension and a minor centerline corresponding to a minor dimension. Inone embodiment, the major dimension corresponding to a major length andthe minor dimension corresponds to a minor length. In one embodiment,the major dimension is a length (L) and the minor dimension is a width.In one embodiment, the major dimension is generally parallel to thelongitudinal axis. In one embodiment, the minor dimension is generallyparallel to the longitudinal axis. In one embodiment, the majorcenterline is perpendicular to the minor centerline. In one embodiment,an internal structure of the computational component is organizedgenerally parallel to the major centerline and in accordance with themajor length. In an embodiment, the major centerline is generallyparallel to the longitudinal axis. In an embodiment, the minorcenterline is generally parallel to the longitudinal axis. In oneembodiment, an internal structure of the computational component isorganized generally parallel to the major centerline. The computingengine further includes a printed circuit board (PCB) comprising aplurality of electrical traces and the printed circuit board has a PCBmajor centerline that is generally parallel to the longitudinal axis. Inone embodiment, the printed circuit board is a central processing unit(CPU) board and a CPU is mounted to a first face of the CPU board andthe CPU is connected to one of the plurality of electrical traces. Inone embodiment, the CPU board further comprising a memory module mountedon a second face of the CPU board opposite the first face of the CPUboard.

The desktop computing system also includes a memory module mechanismdisposed on the second face of the CPU board and configured to providesupport for the memory module. In one embodiment, the memory modulemechanism includes a pair of end guides connected to each other by asupporting member and each end guide comprising a slot configured tohold an end of the memory module and direct the memory module to asocket mounted on the CPU board. In one embodiment, the memory modulemechanism also includes a lock mechanism configured to provide formovement of the memory module mechanism between an unlocked position anda locked position and an actuator attached to a first end guide thatactuates a locking function of the memory module mechanism by receivingan applied force at either the actuator or the supporting member causingthe memory module mechanism to move between the unlocked position andthe locked position. In one embodiment, the supporting member configuredto provide structural support and to facilitate transfer of a portion ofthe applied force to a second end guide opposite the first end guide andto resist torsion of the memory module mechanism. In one embodiment, thememory module mechanism allows insertion and removal of the memorymodule in the unlocked position and restricts insertion and removal ofthe memory module in the locked position. In one embodiment, the memorymodule mechanism providing an over travel movement of the memory modulemechanism in a first direction in response to the applied force receivedat the actuator or the supporting member when the memory modulemechanism is in the locked position. In one embodiment, the memorymodule further includes a spring loaded mechanism that causes the memorymodule mechanism to move in a second direction opposite the firstdirection from the locked position to the unlocked position in responseto the over travel movement. In one embodiment, the memory module is adual in-line memory module having an approximate length of 133 mm. Inone embodiment, the memory module mechanism engages the memory module tothe socket in the locked position and disengages the memory module fromthe socket in the unlocked position. In one embodiment, the lockmechanism comprising a movable linkage assembly comprising a pluralityof interconnected bars. In one embodiment, the housing is a cylindricalhousing that defines a shape of the internal volume as being acylindrical volume.

A desktop computing system is described. The desktop computing systemincludes a housing that encloses an internal volume having alongitudinal axis and a circular cross section defined by a radiusperpendicular to the longitudinal axis. The system also includes aprinted circuit board (PCB) disposed within the internal volume having ashape defined in part by a major centerline that is generally parallelto the longitudinal axis and perpendicular to the radius and radiallypositioned a radial distance from the longitudinal axis and along theradius. In one embodiment, the housing has a cylindrical shape thatdefines a shape of the internal volume as being a cylindrical volume.

In an embodiment, the radius has a maximum radial distance at aninterior surface of the cylindrical housing. In an embodiment, the PCBis part of a stack of interconnected PCBs that includes a centralprocessing unit (CPU) board located at a first radial distance along theradius and having a CPU board centerline generally parallel to thelongitudinal axis and comprising a CPU having a CPU centerline mountedon a first side of the CPU board generally parallel to the CPU boardcenterline, the CPU board comprising a power input node at a first endand a data node comprising one or more wide bandwidth edge connectors ata second end opposite the first end, wherein the first and second endsare located at opposite ends of the CPU major centerline and a powersupply unit coupled to the CPU board and arranged to provide one or moredirect current (DC) voltages to the power input node. In an embodiment,the stack of interconnected PCBs further includes an input/output (I/O)interface board located at a second radial distance greater than radialdistance, each of which is less than maximum radial distance, andincludes a plurality of high speed data ports to one or more externalsystems, and an I/O interface panel comprising a plurality ofilluminable I/O ports at least one of which corresponds to one of theplurality of high speed data ports, wherein when a sensor detectsmovement of the cylindrical desktop computing system, an illuminationpattern display indicator for at least some of the plurality ofilluminable I/O ports is illuminated.

A flexible I/O wall sub-assembly is mounted on an interior surface ofthe I/O interface panel configured to receive an illumination controlsignal in accordance with the movement detected by the sensor. In anembodiment, the flexible I/O wall sub-assembly further includes a lightemitting diodes (LED) that responds to the illumination control signalby generating light and a grouping light guide positioned adjacent to atleast one of the plurality of I/O ports and configured to receive andguide the light generated by the LED through an opening of an opaquelayer on an outer surface of the I/O interface panel, the openingsurrounding at least one of the plurality of I/O ports. In anembodiment, a first portion of the interface panel adjacent the groupinglight guide is at least partially transparent to the light and a secondportion of the interface panel adjacent to the first portion of theinterface panel and adjacent to the at least one I/O port is opaque tothe light. And the first portion of the interface panel includes theillumination pattern display indicator and the second portion of theinterface panel blocks the light from emanating from the at least oneI/O port. In an embodiment, movement includes at least one of rotationalmovement and translational movement.

A method of indicating movement of a desktop computing system isdescribed. The method can be carried out by detecting the movement ofthe desktop computing system by a sensor, providing a movement detectionsignal by the sensor to a processor in accordance with the movement,providing an illumination control signal by the processor in response tothe movement detection signal to an I/O interface panel comprising alight emitting diode (LED), generating light by the LED in response tothe illumination control signal and illuminating an I/O port using atleast some of the light indicating the movement of the desktop computingsystem.

A desktop computing system includes a housing having an axisymmetricshape and a longitudinal axis, an air passage that spans an entirelength of the housing and a computational component disposed within theair passage. In an embodiment, the system includes a heat sink having atriangular cross section disposed within the air passage and in thermalcontact with the computational component where the triangular heat sinkincludes a plurality of planar faces and the computational component ismounted to one planar face of the plurality of planar faces.

A computer architecture is described having an internal componentarrangement that includes an internal component and external interfacearrangement for a cylindrical compact computing system, the internalcomponent and external interface arrangement having a structural heatsink that includes multiple faces to which computational components of acomputing core of the compact computing system are attached including afirst face connected to a second face by a plurality of cooling fins.

A method for illuminating an illumination pattern display indicator fora set of input/output (I/O) ports on an I/O interface panel of a compactcomputing system is described. The method is carried out by detecting atleast one of a rotational movement and a translational movement of thecompact computing system, providing an illumination control signal to anI/O flexible wall sub-assembly mounted on an interior face of the I/Ointerface panel of the compact computing system, and in response to theprovided illumination control signal, activating one or more lightemitting diodes (LEDs) to transmit a beam of light, guided by a groupinglight guide positioned adjacent to the set of I/O ports, through a laseretched opening of a paint layer on an outer surface of the interfacepanel, wherein the laser etched opening surrounds the set of ports. Inone embodiment, a first portion of the interface panel adjacent to thegrouping light guide is at least partially transparent to the beam oflight and a second portion of the interface panel adjacent to the firstportion of the interface panel and adjacent to at least one port in theset of ports is opaque to the beam of light.

A rotating and locking memory module mechanism is described thatincludes a pair of end guides, connected by a supporting member, eachend guide including a slot to hold an end of a memory module and directthe memory module to a socket mounted on a circuit board, a lockmechanism configured to provide for rotation of the memory modulemechanism between an unlocked position and an unlocked position, anactuator attached to a first end guide in the pair of end guides,wherein a user actuates a rotating and locking function of the memorymodule mechanism by applying a pressing force to the actuator or to thesupporting member, thereby rotating the memory module mechanism betweenthe unlocked position and the locked position, and the supporting memberconfigured to provide structural support to transfer a portion of thepressing force applied to the actuator to an end guide opposite theactuator and to resist torsion of the memory module mechanism. In oneembodiment, the memory module mechanism allows insertion and removal ofthe memory module while in the unlocked position and restricts insertionand removal of the memory module while in the locked position.

In an embodiment, a lock mechanism is provided for movement of thememory module mechanism between an unlocked position and a lockedposition and an actuator attached to a first end guide that actuates alocking function of the memory module mechanism by receiving an appliedforce at either the actuator or the supporting member causing the memorymodule mechanism to move between the unlocked position and the lockedposition. In one embodiment, the supporting member configured to providestructural support and to facilitate transfer of a portion of theapplied force to a second end guide opposite the first end guide and toresist torsion of the memory module mechanism. In one embodiment, thememory module mechanism allows insertion and removal of the memorymodule in the unlocked position and restricts insertion and removal ofthe memory module in the locked position.

In one embodiment, the memory module mechanism providing an over travelmovement of the memory module mechanism in a first direction in responseto the applied force received at the actuator or the supporting memberwhen the memory module mechanism is in the locked position. In oneembodiment, the memory module also includes a spring loaded mechanismthat causes the memory module mechanism to move in a second directionopposite the first direction from the locked position to the unlockedposition in response to the over travel movement. In one embodiment, thememory module is a dual in-line memory module having an approximatelength of 133 mm. In one embodiment, the memory module mechanism engagesthe memory module to the socket in the locked position and disengagesthe memory module from the socket in the unlocked position. In oneembodiment, the lock mechanism includes a movable linkage assemblycomprising a plurality of interconnected bars.

A cylindrical desktop computing system includes a computing enginepositioned within a cylindrical housing that cooperates with a thermalmanagement system to promote a high computational processing rate perunit volume.

A memory module mechanism includes a pair of end guides having a firstand second end guides, connected by a supporting member, each end guideincluding a slot to hold an end of a memory module and direct the memorymodule to a socket mounted on a circuit board, a lock mechanismconfigured to provide for rotation of the memory module mechanismbetween an unlocked position and a locked position, and an actuatorattached to a first end guide in the pair of end guides, wherein a useractuates a rotating and locking function of the memory module mechanismby applying a force to the actuator or to the supporting member, therebyrotating the memory module mechanism between the unlocked position andthe locked position.

A method of indicating movement of a desktop computing system isdescribed. The method includes at least the following operations:detecting the movement of the desktop computing system by a sensor,providing a movement detection signal by the sensor to a processor inaccordance with the movement; providing an illumination control signalby the processor in response to the movement detection signal to an I/Ointerface panel comprising a light emitting diode (LED); generatinglight by the LED in response to the illumination control signal;illuminating an I/O port using at least some of the light indicating themovement of the desktop computing system. In one embodiment, receivingat least some of the light generated by the LED by a grouping lightguide adjacent to the plurality of I/O ports that guides some of thereceived light through an opening of an opaque layer on an outer surfaceof the I/O interface panel. In one embodiment, a first portion of theI/O interface panel is adjacent the grouping light guide and is at leastpartially transparent to the light. In one embodiment, a second portionof the I/O interface panel adjacent the first portion of the interfacepanel and adjacent to the at least one I/O port is opaque to the light.

A method for illuminating an illumination pattern display indicator fora set of input/output (I/O) ports on an I/O interface panel of a compactcomputing system is described. The method is carried out by detecting atleast one of a rotational movement and a translational movement of thecompact computing system, providing an illumination control signal to anI/O flexible wall sub-assembly mounted on an interior face of the I/Ointerface panel of the compact computing system, and in response to theprovided illumination control signal, activating one or more lightemitting diodes (LEDs) to transmit a beam of light, guided by a groupinglight guide positioned adjacent to the set of I/O ports, through a laseretched opening of a paint layer on an outer surface of the interfacepanel, wherein the laser etched opening surrounds the set of ports. Inone embodiment, a first portion of the interface panel adjacent to thegrouping light guide is at least partially transparent to the beam oflight and a second portion of the interface panel adjacent to the firstportion of the interface panel and adjacent to at least one port in theset of ports is opaque to the beam of light.

A compact desktop computing system includes a computing engine having agenerally triangular layout that cooperates with a correspondingcylindrical housing and a thermal management system to promote a highcomputational processing rate per unit volume.

A desktop computing system includes a housing having a longitudinal axisthat encloses and defines an internal volume that is symmetric about thelongitudinal axis, a computing engine disposed within the internalvolume, and a structural core positioned within the internal volume thatprovides structural support for the computing engine such that thecomputing engine takes on a general shape of the structural core.

In an embodiment, the structural core comprises a heat sink thatfacilitates removal of heat from the axisymmetric volume. In anembodiment, the heat sink comprising a plurality of planar faces thatprovides the structural core with a shape of a polygon that encloses acentral thermal zone having a cross section in the shape of the polygon.In an embodiment, the computing engine takes on the shape of thestructural core. In an embodiment, the central thermal zone is generallyparallel to the longitudinal axis. In an embodiment, an exterior surfaceof the plurality of planar faces and an interior surface of the housingdefine a peripheral thermal zone apart from the central thermal zone. Inan embodiment, a thermal management system and the computing enginecooperate to maintain a temperature of the computational componentwithin a pre-determined range of operating temperatures. In anembodiment, the housing having the axisymmetric shape is a cylindricalhousing. In an embodiment, wherein the axisymmetric volume is acylindrical volume. In an embodiment, wherein the polygon is a triangle.

A compact desktop computing system includes a housing having alongitudinal axis having a length L, where the housing encloses anddefines an internal space that is symmetric about the longitudinal axisand having a volume V, a computing engine positioned within the internalspace and a thermal management system that is closely coupled with thecomputing engine wherein the thermal management system acts to maintainthe computing engine at a thermal state in accordance with the computingengine operating at an elevated computational processing rate. In anembodiment, thermal management system comprises a structural core thatprovides structural support for the computing engine. In an embodiment,the structural core comprises a plurality of planar faces that form aheat sink having a cross section in accordance with a polygon and thatdefines a central thermal zone.

In an embodiment, at least a portion of the computing engine is mountedto and supported by at least one of plurality of lateral faces and inclose thermal contact with the heat sink. In an embodiment, the closecoupling between the thermal management system and the computing enginecomprises the computing engine taking on a general shape of the heatsink. In an embodiment, the thermal management system further comprisesan air mover configured to move air through the central thermal zone. Inan embodiment, the close coupling between the thermal management systemand the computing engine also includes moving an amount of air at avelocity through the central thermal zone by the air mover in responseto a computational processing rate of the computing engine. In anembodiment, the polygon is a triangle.

In an embodiment, a computational processing density is defined as thecomputational processing rate divided by the volume V. In an embodiment,the housing is cylindrical and wherein the internal space comprises acircular cross section that is perpendicular to the longitudinal axisand having an area A and wherein the volume V is about equal to length Ltimes the area A (L×A). In another embodiment, the housing comprises nlateral faces wherein n is an integer having a value of at least 3 andwherein the internal space comprises an n-sided cross section that isperpendicular to the longitudinal axis and having an area A and whereinthe volume V is about equal to length L times the area A (L×A). In stillanother embodiment, the housing has a shape such that the correspondinginternal space comprises a conical cross section that is perpendicularto the longitudinal axis and having an area A and wherein the volume Vis about equal to length L times the area A (L×A).

A desktop computing system includes a housing having a longitudinal axisand that defines an internal volume that is symmetric about thelongitudinal axis, a computing engine comprising a computationalcomponent, and a structural core positioned within the internal volumethat provides structural support for the computing engine.

A desktop computing system includes a housing having a longitudinal axisand an interior surface that defines an internal volume that issymmetric about the longitudinal axis and a computing engine comprisinga computational component, the computing engine located within theinternal volume comprising a cross section that has a polygonal shapeand that is perpendicular to the longitudinal axis.

A desktop computing system includes a cylindrical housing having alongitudinal axis and that encloses and defines an internal volumehaving a circular cross section centered at the longitudinal axis anddefined by a radius centered at the longitudinal axis and that isperpendicular to the longitudinal axis and a printed circuit board (PCB)disposed within the internal volume comprising a shape defined in partby a major centerline that is parallel to the longitudinal axis and isperpendicular to the radius and is located a distance from thelongitudinal axis along the radius.

A method of indicating a movement of a desktop computing system includesat least the following operations: detecting the movement of the desktopcomputing system by a sensor, providing a movement detection signal bythe sensor to a processor in accordance with the movement, providing anillumination control signal by the processor in response to the movementdetection signal to an I/O interface panel comprising a light emittingdiode (LED), generating a light by the LED in response to theillumination control signal, and illuminating an I/O port using at leastsome of the light indicating the movement of the desktop computingsystem.

A desktop computing system includes a housing having a shape that issymmetric about a longitudinal axis, an air passage spanning an entirelength of the housing, and a computational component disposed within theair passage.

A computer architecture that includes an internal component and externalinterface arrangement for a compact computing system is described. Theinternal component and external interface arrangement includes astructural heat sink having a lengthwise axis and that providesstructural support for a computing engine having a computationalcomponent, the structural heat sink including planar faces that define acentral region having a polygonal cross section that is perpendicular tothe lengthwise axis and at least one of which carries the computationalcomponent, and a cooling that connects an interior surface of a firstplanar face to an interior surface of at least a second planar face andthat spans the central region.

A method for illuminating an illumination pattern display indicator fora set of input/output (I/O) ports on an I/O interface panel of a compactcomputing system is described. The method is carried out by detecting atleast one of a rotational movement and a translational movement of thecompact computing system, providing an illumination control signal to anI/O flexible wall sub-assembly mounted on an interior face of the I/Ointerface panel of the compact computing system, and in response to theprovided illumination control signal, activating one or more lightemitting diodes (LEDs) to transmit a beam of light, guided by a groupinglight guide positioned adjacent to the set of I/O ports, through a laseretched opening of a paint layer on an outer surface of the interfacepanel, where the laser etched opening surrounds the set of ports, andwhere a first portion of the interface panel adjacent to the groupinglight guide is at least partially transparent to the beam of light, andwhere a second portion of the interface panel adjacent to the firstportion of the interface panel and adjacent to at least one port in theset of ports is opaque to the beam of light.

A rotating and locking memory module mechanism includes a pair of endguides, connected by a supporting member, each end guide including aslot to hold an end of a memory module and direct the memory module to asocket mounted on a circuit board, a lock mechanism configured toprovide for rotation of the memory module mechanism between an unlockedposition and locked position, an actuator attached to a first end guidein the pair of end guides, wherein a user actuates a rotating andlocking function of the memory module mechanism by applying a pressingforce to the actuator or to the supporting member, thereby rotating thememory module mechanism between the unlocked position and the lockedposition and the supporting member configured to provide structuralsupport to transfer a portion of the pressing force applied to theactuator to an end guide opposite the actuator and to resist torsion ofthe memory module mechanism. The memory module mechanism allowsinsertion and removal of the memory module while in the unlockedposition and restricts insertion and removal of the memory module whilein the locked position.

A desktop computing system includes a computing engine positioned withina cylindrical housing that defines a cylindrical volume having alongitudinal axis and a thermal management system closely coupled withthe computing engine wherein the thermal management system respondsdirectly to a change in an activity level of the computing engine inreal time.

A memory module mechanism includes a pair of end guides comprising afirst and second end guides, connected by a supporting member, each endguide including a slot to hold an end of a memory module and direct thememory module to a socket mounted on a circuit board, a lock mechanismconfigured to provide for rotation of the memory module mechanismbetween an unlocked position and a locked position, and an actuatorattached to a first end guide in the pair of end guides, wherein a useractuates a rotating and locking function of the memory module mechanismby applying a force to the actuator or to the supporting member, therebyrotating the memory module mechanism between the unlocked position andthe locked position.

A desktop computing system includes a housing having an interior surfacethat defines a cylindrical volume having longitudinal axis and acomputing engine comprising a computational component mounted to aprinted circuit board (PCB), the computing engine located within thecylindrical volume and having a generally triangular cross section thatis perpendicular to the longitudinal axis.

A desktop computing system includes a housing having a longitudinal axisthat encloses and defines an internal volume that is symmetric about thelongitudinal axis, a computing engine disposed within the internalvolume, and a structural heat sink positioned within the internal volumethat provides structural support for the computing engine such that ashape of the computing engine corresponds to a shape of the structuralheat sink and wherein the structural heat sink facilitates removal ofheat from the internal volume.

A compact desktop computing system includes a housing having alongitudinal axis having a length L, wherein the housing encloses anddefines an internal space that is symmetric about the longitudinal axisand having a volume V. a computing engine positioned within the internalspace and a thermal management system that is closely coupled with thecomputing engine wherein the thermal management system enables thecomputing engine to operate at a computational processing rate.

A desktop computing system includes a housing that defines an internalspace, an air passage positioned within the internal space having alength that spans an entire length of the housing, and a computationalcomponent disposed within the air passage wherein an amount of air thatmoves through the air passage is in accordance with a current operationof the computational component.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the invention.However, it will be apparent to one skilled in the art that the specificdetails are not required in order to practice the invention. Thus, theforegoing descriptions of specific embodiments of the present inventionare presented for purposes of illustration and description. They are notintended to be exhaustive or to limit the invention to the precise formsdisclosed. It will be apparent to one of ordinary skill in the art thatmany modifications and variations are possible in view of the aboveteachings.

The embodiments were chosen and described in order to best explain theprinciples of the invention and its practical applications, to therebyenable others skilled in the art to best utilize the invention andvarious embodiments with various modifications as are suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the following claims and their equivalents.

While the embodiments have been described in terms of several particularembodiments, there are alterations, permutations, and equivalents, whichfall within the scope of these general concepts. It should also be notedthat there are many alternative ways of implementing the methods andapparatuses of the present embodiments. It is therefore intended thatthe following appended claims be interpreted as including all suchalterations, permutations, and equivalents as fall within the truespirit and scope of the described embodiments.

What is claimed is:
 1. A desktop computing system, comprising: acomputing engine positioned within a cylindrical housing that defines acylindrical volume having a longitudinal axis; and a thermal managementsystem closely coupled with the computing engine wherein the thermalmanagement system responds directly to a change in an activity level ofthe computing engine in real time and comprises a heat sink and an airmover configured to move an amount of air through the cylindricalvolume, three planar walls that enclose and define a central thermalzone having a triangular cross section, and a cooling fin that spans thecentral thermal zone from a first wall to at least a second wall.
 2. Thedesktop computing system as recited in claim 1, wherein the heat sinkfurther comprises a structural support that provides structural supportfor the computing engine.
 3. The desktop computing system as recited inclaim 2, wherein the cooling fin transfers heat received from thecomputing engine to a portion of the amount of air moving through thecylindrical volume.
 4. The desktop computing system as recited in claim3, wherein the central thermal zone is generally parallel to thelongitudinal axis.
 5. The desktop computing system as recited in claim4, wherein an overall shape of the computing engine conforms to anoverall shape of the heat sink.
 6. The desktop computing system asrecited in claim 5, wherein the cooling fin is one of a number ofcooling fins that span the central thermal zone, wherein some of thenumber of cooling fins extend from the first wall to the at least asecond wall whereas a remaining number of cooling fins extend from thefirst wall to a third wall.
 7. The desktop computing system as recitedin claim 1, wherein the activity level of the computing enginecorresponds to a computational processing rate.
 8. The desktop computingsystem as recited in claim 7, wherein the thermal management systemdirects the air mover to provide the amount of air through the centralthermal zone at a velocity that is commensurate with the activity levelof the computing engine.
 9. The desktop computing system as recited inclaim 1, wherein the cylindrical volume comprises an air passagespanning an entire length of the cylindrical housing.
 10. The desktopcomputing system as recited in claim 9, wherein the air mover isconfigured to: draw the amount of air from outside the cylindricalhousing and move the amount of air into the air passage, move the amountof air through the air passage, and expel the amount of air from the airpassage to an external environment.
 11. The desktop computing system asrecited in claim 10, wherein the amount of air that moves through theair passage is in accordance with the activity level of the computingengine.
 12. The desktop computing system as recited in claim 11, whereinthe air passage comprises a central air passage and a peripheral airpassage.
 13. The desktop computing system as recited in claim 12,wherein the amount of air is split in to a central airflow that movesthrough the central air passage and a peripheral airflow that movesthrough the peripheral air passage, wherein the central airflow and theperipheral airflow are related to the activity level of the computingengine.
 14. The desktop computing system as recited in claim 13 whereinat least a portion of the computing engine is mounted to and supportedby at least one of plurality of planar walls.
 15. The desktop computingsystem as recited in claim 14, wherein a shape of the computing engineconforms to a shape of the heat sink.
 16. The desktop computing systemas recited in claim 1, wherein a velocity of the amount of air movingthrough the central thermal zone is related to an activity level of thecomputing engine.